1. Product Overview

BERGQUIST SIL PAD TSP Q2000 is a glass-reinforced, silicone-based thermal interface material designed as a grease replacement. It provides a reliable thermal solution by eliminating contamination risks associated with thermal grease. The elastomer conforms to surface textures, minimizing air gaps and enhancing thermal performance. Fiberglass reinforcement ensures durability and ease of handling.

Key Features & Benefits:

• Thermal impedance: 0.35°C-in²/W @ 50 psi
• Eliminates processing challenges related to thermal grease
• Conforms to surface textures for better thermal transfer
• Easy handling and processing
• Can be installed before soldering and cleaning

2. Applications

• Between a transistor and a heat sink
• Between large surfaces (e.g., L-bracket and chassis)
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices (e.g., resistors, transformers, solid-state relays)