Industries

BERGQUIST LIQUI FORM TLF LF2000

  • Item Name: BERGQUIST LIQUI FORM TLF LF2000
  • Manufacturer: Henkel
  • Product Category: Thermally Conductive Interface Material
  • Technologies: Silicone-based, one-part, liquid formable, thixotropic, shear-thinning
  • Applications: Thermal management, gap filling, BGA, PGA, PPGA, heat sink interface
  • Color: Gray
  • Cure Type: No curing required (pre-cure gel)
  • Package Size: Contact Avantek for details.
  • Shelf Life: 6 months

1. Product Overview

BERGQUIST LIQUI FORM TLF LF2000 is a high-performance, thermally conductive, one-part liquid formable material. It requires no curing, mixing, or refrigeration, offering excellent thermal management for various applications.

  • Technology: Silicone
  • Appearance: Gray
  • Cure: Pre-cure gel (no curing required)
  • Operating Temperature Range: -60°C to 200°C
  • UL Flammability Rating: UL 94 V-0

2. Applications

  • Bare die to heat spreader lid
  • Gap filler between heat-generating devices and heat sinks/housing
  • Devices requiring low assembly pressure
  • Suitable for BGA, PGA, and PPGA packages

3. Typical Properties

Uncured Material

Property Test Method Value
Viscosity (High Shear, 300 s⁻¹) ASTM D2196 110 Pa·s
Viscosity (Low Shear, 0.001 s⁻¹) ASTM D4473 20,000 mPa·s
Density ASTM D792 2.8 g/cc
Shelf Life @ 25°C 6 months

Cured Material

Property Test Method Value
Volumetric Expansion (25 to 275°C) ASTM E228 (Modified) 600 ppm/°C
Dielectric Strength ASTM D149 10,000 V/mm
Dielectric Constant (1,000 Hz) ASTM D150 8.0
Volume Resistivity ASTM D257 1×10⁹ Ω·m
Total Mass Loss (Outgassing) ASTM E595 0.53%
Thermal Conductivity ASTM D5470 2.0 W/m-K

Thermal Impedance vs. Pressure

Pressure Thermal Impedance (°C-in²/W)
10 psi 0.13
25 psi 0.12
50 psi 0.12

4. Packaging & Storage

  • Available in: 30cc, 600cc cartridges; 5-gallon pails
  • Storage Conditions: 5 to 25°C in sealed containers with moisture barrier packaging
  • Thawing Instructions: Allow to reach room temperature before opening

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