1. Product Overview
BERGQUIST® GAP FILLER TGF 4400LVO is a two-part silicone-based gap filler designed for thermal management in electronic applications. It provides high thermal conductivity (4.4 W/(m.K)) and is suitable for thin bondline thicknesses, offering excellent heat dissipation. The product is compatible with automotive, industrial, and consumer applications.
2. Applications
3. Typical Properties
Uncured Material:
| Property | Part A | Part B | Mixed |
|---|---|---|---|
| Viscosity (Pa.s) | 600 | 500 | – |
| Shelf-life at 25°C (days) | 180* | 180* | – |
| Bondline thickness (µm) | – | – | 110 |
| Density (g/cc) | – | – | 3.1 |
| Working time @ 25°C (min) | – | – | 90 |
| Working time @ 40°C (min) | – | – | 30 |
Curing Performance:
| Cure Temperature | Time |
|---|---|
| 25°C | 12 hours |
| 40°C | 240 minutes |
| 100°C | <15 minutes |
Cured Material Properties:
| Property | Value |
|---|---|
| Hardness (Shore OO) | 85 |
| Heat Capacity (J/(g.K)) | ~0.95 |
| Flammability (UL 94) | V-0 |
| Dielectric constant (ASTM D150) | 8.0 |
| Dielectric strength (kV/mm) | >10 |
| Volume resistivity (Ω.m) | >1010 |
| Thermal conductivity (W/(m.K)) | >4.0 |
| Thermal resistance (@ 1mm) | 2.9 (K.cm²)/W |
Storage & Shipping:
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As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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