BERGQUIST® GAP FILLER TGF 2900LVO is a 2-part, silicone-based, thermally conductive gap filler designed for electronic assembly applications. It features low volatile outgassing (LVO), excellent slump resistance, and outstanding dispensing behavior. With a thermal conductivity of 2.9 W/(m.K) and an ability to achieve ultra-thin bondline thickness, it is suitable for high-performance thermal management.
Key Benefits:
Curing Options:
| Property | Part A | Part B |
|---|---|---|
| Appearance | Blue | White |
| Viscosity (Low shear, 1.0 s⁻¹), Pa·s | 1,300 | 1,300 |
| Viscosity (High shear, 1,500 s⁻¹), Pa·s | 54 | 51 |
| Shelf Life @ 25°C | 270 days | 270 days |
| Property | Value |
|---|---|
| Mix Ratio (Weight & Volume) | 1:1 |
| Bondline Thickness | 35 µm |
| Density (ASTM D792) | 2.97 g/cc |
| Working Time @ 25°C | 120 min |
| Working Time @ 40°C | 20 min |
| Temperature | Cure Time |
|---|---|
| 25°C | 12 hours |
| 40°C | 180 minutes |
| 100°C | < 5 minutes |
| Property | Value |
|---|---|
| Hardness (Shore 00, ASTM D2240) | 55 |
| Heat Capacity (ASTM D1269) | 0.94 J/(g.K) |
| Flammability (UL 94) | V-0 |
| Property | Value |
|---|---|
| Dielectric Constant (ASTM D150 @ 0.1-20 GHz) | 6.78 |
| Volume Resistivity (ASTM D257) | 1×10¹⁰ Ω.m |
| Dielectric Strength (ASTM D149) | > 9 kV/mm |
| Property | Value |
|---|---|
| Thermal Conductivity (ASTM D5470) | 2.9 W/(m.K) |
| Thermal Resistance @ 0.2 mm | 1.2 (K.cm²)/W |
| Thermal Resistance @ 1.0 mm | 3.7 (K.cm²)/W |
| Thermal Resistance @ 2.0 mm | 7.2 (K.cm²)/W |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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