Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST GAP FILLER TGF 1100SF is a high-performance, thermally conductive, liquid gap-filling material that cures into a soft elastomer. It is silicone-free, ultra-conforming, and designed for fragile and low-stress applications. The product cures at ambient or elevated temperatures, providing excellent thermal performance without silicone outgassing.
Key Features:
| Property | Part A | Part B | Mixed |
|---|---|---|---|
| Color | Yellow | Red | Orange (cured) |
| Density (g/cc) | – | – | 2.0 |
| Viscosity @ 25°C (mPa·s) | 1.0 | 1.0 | 450,000 |
| Pot Life @ 25°C (minutes) | – | – | 15 (Fast) / 240 (Slow) |
| Shelf Life @ 25°C (days) | – | – | 180 |
| Property | Value | Test Method |
|---|---|---|
| Hardness (Shore 00) | 60 | ASTM D2240 |
| Heat Capacity (J/g-K) | 0.9 | ASTM E1269 |
| Flammability | UL 94 V-0 | – |
| Dielectric Strength (V/mil) | 400 | ASTM D149 |
| Dielectric Constant (@1,000 Hz) | 5.0 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1×10¹⁰ | ASTM D257 |
| Thermal Conductivity (W/m-K) | 1.1 | ASTM D5470 |
| Condition | TGF 1100SF-15 (Fast) | TGF 1100SF-240 (Slow) |
|---|---|---|
| Work Life (minutes) | 15 | 240 |
| Cure Time @ 25°C | 3 hours | 24 hours |
| Cure Time @ 100°C | 20 minutes | 120 minutes |
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