
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
AIM NC273LT is a no-clean, low-temperature solder paste designed for bismuth alloys. It features an advanced activator system that improves wetting on RoHS-compliant surface finishes. This halogen-free paste offers excellent stencil life (>8 hours), minimal solder balling, and superior wetting. With a peak reflow temperature as low as 170°C-185°C, it is an ideal replacement for lead-free applications where thermal exposure is a concern.
| Condition | Shelf Life | Temperature |
|---|---|---|
| Sealed, Frozen | 6 months | < 0°C (32°F) |
| Sealed, Refrigerated | 4 months | 0°C – 12°C (32°F-55°F) |
| Sealed, Unrefrigerated | 2 weeks | < 25°C (77°F) |
| Parameter | Recommended Setting |
|---|---|
| Squeegee Pressure | 0.9 – 1.5 lbs/inch of blade |
| Squeegee Speed | 0.5 – 6 inches/second |
| Snap-off Distance | On Contact (0.00 mm) |
| PCB Separation Distance | 0.75 – 2.0 mm |
| PCB Separation Speed | 3 – 20 mm/second |
| Phase | Temperature / Time |
|---|---|
| Rate of Rise | 1-3°C/sec max |
| Ramp to 100°C | ≤ 75 sec |
| Progress to 140°C | 30-60 sec |
| Time to Peak (170-185°C) | 45-75 sec |
| Time Above 138°C | 50-80 sec (recommended: 45±15 sec) |
| Cooldown Rate | ≤ 4°C/sec |
| Total Time to Spike | 2.75 – 3.5 min |
| Property | Test Method | Result |
|---|---|---|
| Flux Classification (IPC) | J-STD-004 / J-STD-004B | ROL0 / ROL1 |
| Copper Mirror Test | J-STD-004B 3.4.1.1 | Low |
| Corrosion Test | J-STD-004B 3.4.1.2 | Pass |
| Halide Content (Br/Cl) | EN14582 | <900ppm Br/Cl, <1500ppm Combined |
| Surface Insulation Resistance | J-STD-004B 3.4.1.4 | Pass |
| Viscosity (Print Formula) | J-STD-005A 3.5.1 | 750kcps Typical |
| Viscosity (Dispense Formula) | J-STD-005A 3.5.1 | 400kcps Typical |
| Tack Strength | J-STD-005A 3.8 | 55.3 gf Typical |
| Solder Ball Test | J-STD-005A 3.7 | Pass |
| Wetting Test | J-STD-005A 3.9 | Pass |
| Slump Test | J-STD-005A 3.6 | Pass |
| Acid Value | J-STD-004B 3.4.2.2 | 159.4 mg KOH/g flux |
| Flux Specific Gravity | ASTM D-1298 | 0.98 Typical |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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