NC259FPA is an ultrafine no-clean solder paste developed by AIM for use with Type 6 and finer solder powder. It provides high transfer efficiency, precise print definition, and excellent wetting with shear values up to 150 gf. The flux residue is water-clear and has high surface insulation resistance (SIR). This solder paste offers a long stencil life of up to 8 hours and is recommended for nitrogen reflow. It is also zero-halogen and meets industry standards.
| Property | Test Method | Results |
|---|---|---|
| IPC Flux Classification | J-STD-004A, B, C 3.3 | ROL0 |
| Copper Mirror | IPC-TM-650 2.3.32 | No breakthrough |
| Corrosion | IPC-TM-650 2.6.15 | No corrosion |
| Quantitative Halides | IPC-TM-650 2.3.28.1 | <0.05% (Low) |
| Qualitative Halides | IPC-TM-650 2.3.33 (Silver Chromate) | PASS |
| Halogen Content | EN 14582 | Halogen-free |
| Surface Insulation Resistance (SIR) | IPC-TM-650 2.6.3.7 | ≥ 100 MΩ (No-clean state) |
| Flux Solids Content | IPC-TM-650 2.3.34 | 74% solids |
| Acid Value | IPC-TM-650 2.3.13 | 174.2 mg KOH/g |
| Viscosity (Malcom) | IPC-TM-650 2.4.34 | 170-210 PaS* |
| Slump Resistance | IPC-TM-650 2.4.35 | PASS |
| Tack Force | JIS standard Z 3284 | 120 gf |
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