
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
NC257MD is a no-clean solder paste specially developed for Mycronic Jet Printers, designed to provide consistent and reliable jet printing performance. It features clear, pin-probe testable residues, excellent wetting properties, and low voiding under micro-BGAs and BTC devices. The paste is optimized for use with the Mycronic AG Type Ejector, prolonging ejector life and reducing paste consumption. It supports vapor phase compatibility and maintains an 8-12 hour tack time for stable performance during assembly.
| Property | Test Method | Results |
|---|---|---|
| IPC Flux Classification | J-STD-004, J-STD-004B 3.3.1 | ROL0, ROL1 |
| Copper Mirror | IPC-TM-650 2.3.32 | Low |
| Corrosion | IPC-TM-650 2.6.15 | PASS |
| Quantitative Halides | IPC-TM-650 2.3.28.1 | L1 |
| Qualitative Halides (Silver Chromate) | IPC-TM-650 2.3.33 | PASS |
| Qualitative Halides (Fluoride Spot) | IPC-TM-650 2.3.35.1 | No Fluoride |
| Surface Insulation Resistance (SIR) | IPC-TM-650 2.6.3.7 | PASS |
| Electrochemical Migration | IPC-TM-650 2.6.14.1 | PASS |
| Flux Solids Content | IPC-TM-650 2.3.34 | 86.9% |
| Acid Value | IPC-TM-650 2.3.13 | 149 mg KOH/g |
| Flux Specific Gravity | ASTM D-1298 | 3.39 |
| Viscosity | IPC-TM-650 2.4.34 | 450-550 Kcps |
| Slump Resistance | IPC-TM-650 2.4.35 | PASS |
| Solder Ball Test | IPC-TM-650 2.4.43 | PASS |
| Tack Force | IPC-TM-650 2.4.44 | 32.8 gf |
| Wetting Performance | IPC-TM-650 2.4.45 | PASS |
| Visual Appearance | – | Gray, Smooth, Creamy |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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