Brands: Scotch-Weld™
Package Sizes:
Shelf Life: 18 months
3M™ Scotch-Weld™ Epoxy Potting Compound DP270 Black is a two-part, low-viscosity epoxy resin system designed primarily for potting, sealing, and encapsulating electronic components. It is non-corrosive to copper and offers good thermal shock resistance, along with excellent retention of electrical insulation properties under high humidity conditions. The product has a work life of approximately 70 minutes, a tack-free time of about 3 hours, and reaches full cure after 48 hours at 73°F (23°C). It produces minimal exotherm, making it suitable for heat-sensitive components.
| Attribute | Base Component | Accelerator Component |
|---|---|---|
| Color | Black | Amber |
| Viscosity | 7,000 – 16,000 cP¹ | 6,000 – 12,000 cP² |
| Mix Ratio by Volume (B:A) | 1:1 | |
| Mix Ratio by Weight (B:A) | 1:0.85 |
¹ Viscosity measured at 23°C (73°F).
² Viscosity measured at 23°C (73°F).
| Attribute | Value |
|---|---|
| Work Life | 60 – 70 minutes at 23°C (73°F) |
| Tack-Free Time | Approximately 3 hours at 23°C (73°F) |
| Time to Handling Strength | Approximately 3 hours at 23°C (73°F) |
| Full Cure Time | 48 hours at 23°C (73°F) |
| Attribute | Test Method | Value |
|---|---|---|
| Shore D Hardness | ASTM D2240 | 83 |
| Compression Strength | ASTM D695 | 8,100 psi at 23°C (73°F) |
| Thermal Shock Resistance | 3M C3174 | Passes 5 cycles without cracking (Test Condition: Potted Washer Olyphant Test, 100°C [air] ~ -50°C [liquid]) |
Overlap Shear Strength
| Substrate | Surface Preparation | Test Temperature | Dwell Time | Strength¹ |
|---|---|---|---|---|
| Copper | MEK Wipe | 23°C (73°F) | 7 days | 1,700 – 1,750 psi |
| FR-4 | MEK Wipe | 23°C (73°F) | 7 days | 1,750 – 1,800 psi |
¹ Tested per ASTM D1002, ISO 4587.
T-Peel Adhesion
| Substrate | Surface Preparation | Test Temperature | Dwell Time | Strength¹ |
|---|---|---|---|---|
| Aluminum to Etched Aluminum | Etched | 23°C (73°F) | Not specified | <2 lb/in width |
¹ Tested per ASTM D1876.
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