RMA258-15R is a rosin-based solder paste designed for high-reliability and military electronics. It offers long pause-to-print capabilities, enhanced wetting, and fine print definitions. It performs well under extended, high-temperature reflow profiles and reduces voiding in BGA/BTC components. Its residues can be removed using various cleaning methods, though cleaning is not required.
| Property | Test Method | Results |
|---|---|---|
| Flux Classification | J-STD-004 | ROL0 |
| Copper Mirror Test | IPC-TM-650 2.3.32 | LOW |
| Corrosion | IPC-TM-650 2.6.15 | PASS |
| Qualitative Halides | IPC-TM-650 2.3.33 | PASS |
| Fluoride Spot Test | IPC-TM-650 2.3.35.1 | No Fluoride |
| Surface Insulation Resistance | IPC-TM-650 2.6.3.3 | PASS |
| Flux Solids (Nonvolatile) | IPC-TM-650 2.3.34 | 95.7% |
| Acid Value | IPC-TM-650 2.3.13 | 133 mg KOH/g flux |
| Specific Gravity | ASTM D-1298 | 3.68 |
| Viscosity | IPC-TM-650 2.4.34 | Print/Dispense versions available |
| Visual Appearance | J-STD-004 3.4.2.5 | Gray, Smooth, Creamy |
| Slump | IPC-TM-650 2.4.35 | PASS |
| Solder Ball Test | IPC-TM-650 2.4.43 | PASS |
| Tack Strength | IPC-TM-650 2.4.44 | 48.8 g |
| Wetting | IPC-TM-650 2.4.45 | PASS |
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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