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Indium 8.9HF1 – Indium PASTEOT-800595-500g-T3 Solder Paste, No Clean, Lead Free, T3, 88.5%, SAC305, 500g Jar

• Alternate Product Number: PASTEOT-800595-500G
• Mfr Part: PASTEOT-800595-500g-T3
• Brand: Indium
• Alloy: SAC305
• Lead Type: Lead Free
• Composition: 96.5% Tin, 3% Silver, 0.5% Copper
• Type: Solder Paste
• Package: 500g Jar
• Shelf Life: 6 months

1. Product Overview

Indium PASTEOT-800596-500g-T4 is a high-performance, no-clean, lead-free solder paste designed for PCB assembly and semiconductor manufacturing. It contains SAC305 alloy and features a high oxidation barrier to eliminate graping and Head-in-Pillow (HIP) defects. This solder paste ensures excellent print transfer efficiency and high probe testability, reducing false failures in in-circuit testing (ICT). It is also halogen-free and supports various deposition techniques.

2. Applications

  • PCB assembly and semiconductor manufacturing
  • Suitable for fine-pitch components (0.4mm pitch CSPs)
  • Ideal for printing, dipping, dispensing, jetting, and pin transfer assembly
  • Helps prevent defects such as warpage-induced issues, voiding, and insufficient solder volume

3. Typical Properties – Specifications

Property Specification
Brand Indium
Alloy SAC305 (96.5% Sn, 3% Ag, 0.5% Cu)
Flux Type ROL0 (No-Clean)
Lead Content Lead-Free
Powder Mesh Size T4
Metal Percentage 88.25%
Halogen Content Halogen-Free
Package Type 500g Jar
Shelf Life 6 months
Physical State Paste
Series 8.9HF1 Series

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