TSE326M EX Key Features & Benefits

✔ One-component system – No mixing required
✔ Excellent high-temperature resistance – Suitable for demanding environments
✔ Fast heat-accelerated cure – Cures in 0.5 hours at 200°C, 1.5 hours at 150°C, or 3 hours at 120°C
✔ Strong adhesion – Bonds well to various substrates without a primer
✔ Non-corrosive – Safe for metals and electronic components

TSE326M EX Applications

• High-temperature bonding and sealing
• Electronics encapsulation and protection
• Automotive and industrial adhesive applications
• Adhesion to metals, plastics, ceramics, and glass

Adhesion Capability

✔ Suitable Substrates:

• Metals – Aluminum, Copper, Nickel-plated, Stainless Steel
• Plastics – PPS, PBT, Epoxy Resin, Polyester, Phenolic Resin
• Rubbers – Heat-cured silicone rubber
• Inorganics – Glass, Ceramics

✖ Not Suitable for:

• Plastics – PP, PE, Fluorocarbon resin
• Rubbers – RTV silicone rubber, Sulfur-vulcanized rubber, Fluorocarbon rubber

Processing Recommendations

✔ Surface Preparation: Ensure substrates are clean and dry before application.
✔ Cure Conditions:

• 120°C: 3 hours
• 150°C: 1.5 hours
• 200°C: 0.5 hours
  ✔ Compatibility Test: Some materials (e.g., sulfur, nitrogen compounds, metallic salts, phosphorus compounds) may inhibit curing. Perform a test patch before full application.