
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
LOCTITE ECCOBOND EN 3707F is a light yellow, one-component epoxy encapsulant designed for local circuit board protection. It features dual-cure capability, allowing fast UV curing with a secondary heat cure for shadowed areas. The adhesive offers easy dispensability without stringing and is fluorescent under UV light for inspection purposes.
| Properties | Values |
|---|---|
| Unmixed Properties | |
| Technology | Epoxy |
| Appearance | Light yellow liquid |
| Viscosity (Brookfield CP51, 25°C) | 3,480 mPa·s (cP) @ 20 rpm |
| Pot Life (@ 25°C) | 3 days |
| Shelf Life (@ 2 to 8°C) | 180 days (6 months) |
| Fluorescence | Yes (under UV light) |
| Curing Properties | |
| UV Cure (UVA/UVB) | 100 mW/cm² for >30 seconds |
| Depth of Cure (UV, 100 mW/cm² for 30s) | ≥10 mm |
| Heat Cure Options | 30 min @ 80°C / 5 min @ 100°C / 1-2 min @ 130°C |
| Cured Properties | |
| Glass Transition Temperature (Tg) | 36.8°C |
| Coefficient of Thermal Expansion (TMA) | Below Tg: 50.3 ppm/°C / Above Tg: 162.2 ppm/°C |
| Storage Modulus (DMA @ 25°C) | 4,400 N/mm² (638,000 psi) |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

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Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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