FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JD322
Technology: One-Component Epoxy Adhesive
Color: Black
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 6 months
Everwide JD322 is a one-component epoxy adhesive designed for bonding electronic components. It provides excellent adhesion strength and fast curing at medium-low temperatures, making it suitable for plastics bonding, memory cards, CMOS assembly, and heat-sensitive components. The cured product exhibits low gloss, excellent dimensional stability, and strong chemical and solvent resistance.
| Property | JD322 |
|---|---|
| Appearance | Liquid |
| Color | Black |
| Viscosity (25°C, S14 5rpm, cps) | 128,000–192,000 |
| Thixotropic Index | 4–6 |
| Filler Grain Size (µm) | 2–5 (Max <10) |
| Filler Ratio (%) | 23 |
| Chloride (Cl) (ppm) | <50 |
| Potassium (K) (ppm) | <10 |
| Sodium (Na) (ppm) | <30 |
| Property | Value |
|---|---|
| Pot Life (25°C) | 2 days |
| Cure Time (80°C) | 60 min |
| Cure Time (90°C) | 50 min |
| Cure Time (100°C) | 40 min |
| Cure Time (120°C) | 30 min |
| Cure Time (150°C) | 20 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (DSC) | 132°C |
| Glass Transition Temperature (Tg) (TMA) | 152°C |
| CTE (<Tg) (µm/m/°C) | 48 |
| CTE (>Tg) (µm/m/°C) | 162 |
| Durometer Hardness (Shore D) | 90 |
| Specific Gravity | 1.33 |
| Water Absorption (25°C, 24 hr) | 0.36% |
| Water Absorption (80°C, 24 hr) | 1.54% |
| Water Absorption (97°C, 1.5 hr) | 0.86% |
| Shear Strength (LCP vs. PCB-FR4, 120°C, 30 min) | 162 kgf/cm² |
| Shear Strength (LCP vs. PCB-FR4, 150°C, 60 min) | 218 kgf/cm² |
| Thrust Force (PC vs. PCB-FR4) | 112.6 kg |
| Substrate Breaking Strength (Epoxy Sheet) | 285 kg/cm² |
| Elongation (%) | 7.2 |
| Flexural Modulus (GPa) | 11 |
| Young’s Modulus (25°C) | 8 GPa |
| Young’s Modulus (120°C) | 0.4 GPa |
| Volume Shrinkage (%) | 2.9 |
| Degradation Temperature (TGA, 10°C/min) | 413°C |
| Thermal Conductivity | 0.5 W/mK |
| Thermal Resistance | 0.006 m²K/W |
| Volume Resistivity | 4.5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 4.5 × 10¹⁴ ohm |
| Dielectric Strength | 16 kV/mm |
| Temperature Resistance Range | -40 to 150°C |
| Dielectric Constant (1 kHz) | 3.315 |
| Dielectric Loss (1 kHz) | 0.02 |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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