FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JC823-6
Technology: One-Component Epoxy Adhesive
Color: Black
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 8 months
Everwide JC823-6 is a one-component, reworkable epoxy adhesive developed for BGA and CSP underfill applications in electronic devices. It provides excellent flowability, low viscosity, and strong mechanical properties to buffer expansion and contraction stress at solder ball contacts, improving impact and shear resistance. The adhesive exhibits fast curing at high temperatures, allowing increased production efficiency and shortened working times.
| Property | JC823-6 |
|---|---|
| Appearance | Liquid |
| Color | Black |
| Viscosity (25°C, S14 100rpm, cps) | 2,500–4,000 |
| Specific Gravity (20/20°C) | 1.18 |
| Property | Value |
|---|---|
| Pot Life (25°C) | 2 days |
| Cure Time (80°C) | 30 min |
| Cure Time (100°C) | 15 min |
| Cure Time (120°C) | 10 min |
| Cure Time (150°C) | 5 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (TMA) | 50°C |
| CTE (<Tg), µm/m/°C | 30 |
| CTE (>Tg), µm/m/°C | 178 |
| Specific Heat (0°C) | 1.01 J/g°C |
| Specific Heat (50°C) | 1.40 J/g°C |
| Specific Heat (100°C) | 1.62 J/g°C |
| Durometer Hardness (Shore D) | 80 |
| Specific Gravity (20/20°C) | 1.218 |
| Water Absorption (25°C, 24 hr) | 0.95% |
| Water Absorption (80°C, 24 hr) | 2.40% |
| Water Absorption (97°C, 1.5 hr) | 1.89% |
| Shear Strength (Al vs. Al) | 173 kgf/cm² |
| Flexural Modulus (25°C, DMA) | 0.4 GPa |
| Young’s Modulus | 0.4 GPa |
| Elongation | 20% |
| Elongation Breaking Strength | 231 kgf |
| Degradation Temperature (TGA, 10°C/min) | 325°C |
| Volume Resistivity | 4.5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 4.5 × 10¹⁴ ohm |
| Dielectric Constant (1 kHz) | 3.2 |
| Dielectric Strength | 18 kV/mm |
| Temperature Range | -40 to 100°C |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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