FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JC750-11W
Technology: One-Component Epoxy Adhesive
Color: White
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 6 months
Everwide JC750-11W is a one-component epoxy adhesive designed for electronic device bonding. This product offers a long pot life, making it ideal for industrial applications requiring extended processing times. The cured resin exhibits high adhesion strength, extreme hardness, outstanding grease resistance, and excellent chemical and solvent resistance. It also features fast curing at low temperatures, making it suitable for various material bonding applications. Additionally, it provides superior durability and vibration resistance, ensuring strong performance in electronic assemblies such as relay and heat-sensitive component bonding.
| Property | JC750-11W |
|---|---|
| Appearance | Liquid |
| Color | White |
| Viscosity (25°C, S14 50rpm, cps) | 16,000–25,000 |
| Thixotropic Index | ≥1.5 |
| Property | Value |
|---|---|
| Pot Life (25°C) | 3 days |
| Gel Time (80°C) | 5 min |
| Through Cure Time (80°C) | 30 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (MDSC) | 30°C |
| CTE (<Tg), µm/m/°C | 41 |
| CTE (>Tg), µm/m/°C | 214 |
| Specific Heat (0°C) | 4.99 J/g°C |
| Specific Heat (25°C) | 5.27 J/g°C |
| Specific Heat (50°C) | 5.46 J/g°C |
| Specific Heat (75°C) | 5.63 J/g°C |
| Specific Heat (100°C) | 5.71 J/g°C |
| Durometer Hardness (Shore D) | 80 |
| Specific Gravity | 1.66 |
| Water Absorption (25°C, 24 hr) | 0.67% |
| Water Absorption (80°C, 24 hr) | 1.99% |
| Water Absorption (97°C, 1.5 hr) | 1.75% |
| Shear Strength (Al vs. Al) | 125 kgf/cm² |
| Shear Strength (Stainless Steel vs. Stainless Steel) | 118 kgf/cm² |
| Degradation Temperature (TGA, 10°C/min) | 352°C |
| Weight Loss Ratio @ 100°C | 0% |
| Weight Loss Ratio @ 150°C | 0% |
| Weight Loss Ratio @ 200°C | 0% |
| Weight Loss Ratio @ 250°C | 0.10% |
| Weight Loss Ratio @ 300°C | 0.34% |
| Weight Loss Ratio @ 350°C | 4.51% |
| Thermal Conductivity | 0.3 W/mK |
| Thermal Resistance | 0.01 m²K/W |
| Volume Resistivity | 5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 5 × 10¹⁴ ohm |
| Dielectric Constant (100Hz) | 4.1 |
| Dielectric Strength | 18 kV/mm |
| Recommended Temperature Range | -40 to 120°C |
| High-Temperature Limit After Curing | 100°C |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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