FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Everwide
Product Number: JC750-11
Technology: One-Component Epoxy Adhesive
Color: Black
Cure Type: Heat Curing
Package Size: Contact us for details
Shelf Life: 8 months
Everwide JC750-11 is a one-component epoxy adhesive designed for electronic component bonding. It offers long pot life, making it suitable for industrial applications requiring extended processing times. The cured resin exhibits excellent adhesion strength, high hardness, outstanding grease, chemical, and solvent resistance, and fast curing at low temperatures. It is well-suited for relay assembly and heat-sensitive component bonding.
| Property | JC750-11 |
|---|---|
| Appearance | Liquid |
| Color | Black |
| Viscosity (25°C, S14 50rpm, cps) | 15,000–20,000 |
| Viscosity (25°C, S14 5rpm, cps) | 25,000–35,000 |
| Thixotropic Index | ≥1.5 |
| Property | Value |
|---|---|
| Pot Life (25°C) | 3 days |
| Gel Time (80°C) | 5 min |
| Through Cure Time (80°C) | 30 min |
| Property | Value |
|---|---|
| Glass Transition Temperature (Tg) (MDSC) | 30°C |
| CTE (<Tg), µm/m/°C | 41 |
| CTE (>Tg), µm/m/°C | 214 |
| Durometer Hardness (Shore D) | 80 |
| Specific Gravity | 1.66 |
| Water Absorption (25°C, 24 hr) | 0.67% |
| Water Absorption (80°C, 24 hr) | 1.99% |
| Water Absorption (97°C, 1.5 hr) | 1.75% |
| Shear Strength (Al vs. Al) | 125 kgf/cm² |
| Shear Strength (Stainless Steel vs. Stainless Steel) | 118 kgf/cm² |
| Degradation Temperature (TGA, 10°C/min) | 352°C |
| Weight Loss Ratio @ 100°C | 0% |
| Weight Loss Ratio @ 150°C | 0% |
| Weight Loss Ratio @ 200°C | 0% |
| Weight Loss Ratio @ 250°C | 0.10% |
| Weight Loss Ratio @ 300°C | 0.34% |
| Weight Loss Ratio @ 350°C | 4.51% |
| Thermal Conductivity | 0.3 W/mK |
| Thermal Resistance | 0.01 m²K/W |
| Flow Length Ratio | 10–30 mm |
| Volume Resistivity | 5 × 10¹⁵ ohm-cm |
| Surface Resistivity | 5 × 10¹⁴ ohm |
| Dielectric Constant (100 Hz) | 4.1 |
| Dielectric Strength | 18 kV/mm |
| Recommended Temperature Range | -40 to 120°C |
| High Temperature Range After Curing | 100°C |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
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