SilCool™ TIG210BX is a high-performance, silicone-based thermal grease that provides efficient heat dissipation for electronic components. It features high thermal conductivity (2.1 W/m·K), virtually no oil separation, and minimal weight loss at elevated temperatures, ensuring long-term reliability in thermal interface applications.

Designed for power electronics, semiconductor packaging, and LED modules, TIG210BX offers stable thermal performance across a wide temperature range (-40°C to 150°C), making it suitable for demanding thermal management applications.

Key Features & Benefits

✅ High Thermal Conductivity (2.1 W/m·K) – Optimized for efficient heat transfer.
✅ Low Oil Bleed & Minimal Weight Loss – Ensures long-term thermal stability.
✅ Wide Operating Temperature Range (-40°C to 150°C) – Suitable for harsh environments.
✅ Minimal Ionic Impurities (<2 ppm Na⁺, 0 ppm K⁺, 0 ppm Cl⁻) – Prevents corrosion in sensitive electronics.
✅ Non-Curing Formula – Allows easy application and reworkability.
✅ Excellent Workability – Suitable for automated dispensing and manual application.

Potential Applications

📌 Thermal Interface Material (TIM2) – Used in heat spreaders, heat sinks, and heat pipes.
📌 Power Electronics & Semiconductor Packaging – Ensures efficient cooling for high-power devices.
📌 LED & Display Modules – Reduces heat buildup for prolonged component life.
📌 Automotive & Battery Systems – Ideal for EV batteries, control modules, and power inverters.