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Momentive SilCool™ TIG830SP High thermal conductivity grease

  • Item No: SilCool™ TIG830SP
  • Manufacturer: Momentive
  • Technologies: Silicone-based
  • Color: Gray paste
  • Cure Type: Non-curing
  • Package Size: contact us for detail
  • Shelf Life: contact us for detail

SilCool™ TIG830SP is a high-performance, silicone-based thermal grease designed to provide superior heat dissipation for electronic components. It features high thermal conductivity (4.1 W/m·K), low thermal resistance, and thin bond lines, making it an excellent candidate for screen printing and automated dispensing processes.

The grease maintains stable performance over a wide temperature range (-40°C to 150°C) with minimal weight loss and ionic impurities, ensuring long-term reliability in power electronics, LED modules, and semiconductor applications.


Key Features & Benefits

✅ High Thermal Conductivity (4.1 W/m·K) – Ensures efficient heat transfer and dissipation.
✅ Low Thermal Resistance (12 mm²·K/W @ 20µm BLT) – Reduces thermal interface resistance.
✅ Highly Workable & Easy Application – Suitable for screen printing and automated dispensing.
✅ Thin Bond Line Capability – Optimized for high-performance thermal interfaces.
✅ Wide Operating Temperature Range (-40°C to 150°C) – Stable in extreme environments.
✅ Minimal Weight Loss at High Temperatures – Prevents performance degradation over time.
✅ Low Ionic Impurities (<1 ppm Na⁺, K⁺, Cl⁻) – Prevents corrosion in sensitive electronics.

Potential Applications

📌 Thermal Interface Material (TIM2) – Provides efficient heat transfer in high-performance electronics.
📌 Power Electronics & Semiconductor Packaging – Ensures effective cooling for high-power devices.
📌 LED & Optical Devices – Reduces heat buildup in LED modules and optical components.
📌 Automotive & Battery Systems – Used in EV batteries, control modules, and power inverters.

Property Unit Value
Appearance Gray paste
Thermal Conductivity W/m·K 4.1
Viscosity (@ 23°C) Pa·s 300
Penetration (@ 23°C) 360
Specific Gravity (@ 23°C) 2.88
Bleed (150°C, 24h) wt% 0.0
Evaporation (150°C, 24h) wt% 0.3
Thermal Resistance (BLT 20 µm) mm²·K/W 12
Volatile Siloxane (D4-D10) ppm <100
Ionic Impurities (Na⁺, K⁺, Cl⁻) ppm Na⁺: 0.5, K⁺: 0.0, Cl⁻: 0.1

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