LOCTITE ABLESTIK ABP 8910T is a BMI Hybrid die attach adhesive with high thermal conductivity, electrical insulation, and high reliability. It is designed for medium to large die sizes and offers high MRT performance.
| Property | Value |
|---|---|
| Thixotropic Index (0.5/5 rpm) | ≥4.5 |
| Viscosity (Brookfield CP51, 25 °C, 5 rpm) | 13,000 mPa·s (cP) |
| Work Life @ 25°C | 24 hours |
| Shelf Life @ -40°C | 365 days |
| Cure Schedule | Condition |
|---|---|
| Step 1 | 30-minute ramp to 175°C |
| Step 2 | 15 minutes at 175°C |
| Property | Value |
|---|---|
| Coefficient of Thermal Expansion (CTE) (ppm/°C) | Below Tg: 28, Above Tg: 96 |
| Glass Transition Temperature (Tg) | 30°C |
| Thermal Conductivity | 1.3 W/(m·K) |
| Extractable Ions (ppm) | Cl⁻: ≤20, Na⁺: ≤20, K⁺: ≤20 |
| Temperature | Tensile Modulus (N/mm²) | Tensile Modulus (psi) |
|---|---|---|
| -65°C | 10,270 | 1,488,960 |
| 25°C | 8,870 | 1,285,905 |
| 150°C | 2,030 | 294,860 |
| 200°C | 1,096 | 158,920 |
| 250°C | 1,007 | 146,015 |
| Condition | Substrate | Strength (kg-f/die) |
|---|---|---|
| @ 25°C | Silver | 15.4 |
| @ 200°C | Silver | 5.5 |
| @ 250°C | Silver | 4.4 |
| Post Mold Bake (PMB) | Silver | 4.3 |
| Copper | 16.7 | |
| PPF | 2.1 | |
| Alloy 42 | 8.5 | |
| PMB + 5 min @ 270°C | Silver | 2.0 |
| Copper | 15.6 | |
| PPF | 1.9 | |
| Alloy 42 | 8.1 | |
| PMB + Moisture | Silver | 1.1 |
| Copper | 4.6 | |
| PPF | 1.4 | |
| Alloy 42 | 1.9 |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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