Applications

RTVS 8127

Brand: Insulcast

Package Sizes: Contact us for details.

Shelf Life: 12 months

Product Description:

RTVS 8127 is a low-viscosity, flame-retardant, reversion-resistant silicone compound designed for potting dense component packages requiring heat dissipation. It features high thermal conductivity (0.75 W/m·K), excellent thermal stability, and electrical insulation properties. This UL 94V-0-certified compound is compatible with most electrical insulating materials, making it ideal for high-performance potting and encapsulation applications.


Key Features:

Low Viscosity: Provides easy flow and penetration into complex assemblies.
High Thermal Conductivity (0.75 W/m·K): Ensures efficient heat dissipation.
Flame Retardant (UL 94V-0): Meets stringent fire safety requirements.
Excellent Thermal Stability: Maintains performance in extreme temperature conditions.
Superior Electrical Properties: Offers high dielectric strength and volume resistivity.
Reversion Resistant: Prevents degradation over time.


Recommended Applications:

🔹 Electronic Potting & Encapsulation: Protects dense electronic components requiring heat dissipation.
🔹 Power Electronics & Heat Management: Ensures thermal stability in transformers, PCBs, and power modules.
🔹 Aerospace & Automotive Electronics: Suitable for vibration-resistant and high-temperature applications.
🔹 Industrial Equipment: Provides long-term insulation and flame resistance.

Uncured Properties (@ 25°C)

Property Part A Part B Mixed Test Standard
Color Grey Neutral Visual
Viscosity (cP) 5,000 3,000 4,000 ASTM D1084
Specific Gravity 1.78 1.78
Mix Ratio (by Weight) 1:1
Pot Life (100g mass) 160-220 min

Cured Properties (@ 25°C)

Property Value Test Standard
Hardness (Shore A) 55 ASTM D2240
Tensile Strength (psi / MPa) 420 / 2.9 ASTM D412
Tensile Elongation (%) 120 ASTM D412
Coefficient of Thermal Expansion (m/m·K) 18 × 10⁻⁵
Thermal Conductivity (W/m·K) 0.75
Service Temperature Range (°C) -55 to +204

Electrical Properties (@ 25°C)

Property Value Test Standard
Dielectric Strength (V/mil) 500 ASTM D149
Dielectric Constant (1 kHz) 4.0 ASTM D150
Dissipation Factor (1 kHz) 0.005 ASTM D150
Volume Resistivity (ohm-cm) 1.0 × 10¹⁵ ASTM D257

Cure Schedule:

Cure Method Time & Temperature
Room Temperature Cure 24 hours at 25°C (77°F)
Accelerated Cure 2 hours at 60°C (140°F)
Rapid Cure 30 minutes at 95°C (203°F)
High-Speed Cure 15 minutes at 120°C (248°F)

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