
FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
Brand: Insulcast
Package Sizes: Contact us for details.
Shelf Life: 12 months
RTVS 8127 is a low-viscosity, flame-retardant, reversion-resistant silicone compound designed for potting dense component packages requiring heat dissipation. It features high thermal conductivity (0.75 W/m·K), excellent thermal stability, and electrical insulation properties. This UL 94V-0-certified compound is compatible with most electrical insulating materials, making it ideal for high-performance potting and encapsulation applications.
✅ Low Viscosity: Provides easy flow and penetration into complex assemblies.
✅ High Thermal Conductivity (0.75 W/m·K): Ensures efficient heat dissipation.
✅ Flame Retardant (UL 94V-0): Meets stringent fire safety requirements.
✅ Excellent Thermal Stability: Maintains performance in extreme temperature conditions.
✅ Superior Electrical Properties: Offers high dielectric strength and volume resistivity.
✅ Reversion Resistant: Prevents degradation over time.
🔹 Electronic Potting & Encapsulation: Protects dense electronic components requiring heat dissipation.
🔹 Power Electronics & Heat Management: Ensures thermal stability in transformers, PCBs, and power modules.
🔹 Aerospace & Automotive Electronics: Suitable for vibration-resistant and high-temperature applications.
🔹 Industrial Equipment: Provides long-term insulation and flame resistance.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Grey | Neutral | – | Visual |
| Viscosity (cP) | 5,000 | 3,000 | 4,000 | ASTM D1084 |
| Specific Gravity | 1.78 | 1.78 | – | – |
| Mix Ratio (by Weight) | 1:1 | – | – | – |
| Pot Life (100g mass) | 160-220 min | – | – | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 55 | ASTM D2240 |
| Tensile Strength (psi / MPa) | 420 / 2.9 | ASTM D412 |
| Tensile Elongation (%) | 120 | ASTM D412 |
| Coefficient of Thermal Expansion (m/m·K) | 18 × 10⁻⁵ | – |
| Thermal Conductivity (W/m·K) | 0.75 | – |
| Service Temperature Range (°C) | -55 to +204 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 500 | ASTM D149 |
| Dielectric Constant (1 kHz) | 4.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.005 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 1.0 × 10¹⁵ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 24 hours at 25°C (77°F) |
| Accelerated Cure | 2 hours at 60°C (140°F) |
| Rapid Cure | 30 minutes at 95°C (203°F) |
| High-Speed Cure | 15 minutes at 120°C (248°F) |

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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Partial Gasket & Seal Strategies Using Henkel Loctite SI 5910
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