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BERGQUIST® GAP PAD TGP 7000ULM BLU

  • Item Name: BERGQUIST® GAP PAD TGP 7000ULM BLU
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (TIM)
  • Technologies: Silicone-based, ultra-low modulus, high thermal conductivity
  • Applications: Telecommunications, optical transceivers, ASICs, DSPs, aerospace modules
  • Color: Blue
  • Cure Type: Not applicable (Gap Pad, pre-formed material)
  • Package Size: Contact Avantek for details
  • Shelf Life: 6 months

1. Product Overview

BERGQUIST® GAP PAD TGP 7000ULM BLU is a highly conformable silicone-based thermal interface material with exceptional thermal performance. It has an ultra-low modulus, allowing for minimal compression stress and excellent heat transfer. The material features a thermal conductivity of 7.5 W/m-K and does not exhibit mobile polymer bleed. It is designed for high-performance applications requiring low assembly stress and superior surface wet-out.

2. Applications

  • Telecommunications (routers, switches, base stations)
  • Optical transceivers
  • ASICs and DSPs
  • Aerospace modules

3. Typical Properties

Property Value Test Standard
Physical Properties
Hardness, Shore 000 70 ASTM D2240
Density (g/cc) 3.2 ASTM D792
Heat Capacity (J/g-K) 0.8 ASTM E1269
Young’s Modulus (psi) 36
Shelf Life (days) 180
Electrical Properties
Volume Resistivity (ohm-meter) 2×10¹⁰ ASTM D257
Dielectric Constant (1,000Hz) 7.4 ASTM D150
Dielectric Strength (KV/mil) 412
Thermal Properties
Thermal Conductivity (W/m-K) 7.5 ASTM D5470

Storage Recommendations

  • Store in an unopened container in a dry location.
  • Optimal storage: 5 to 28°C, 50% RH (±10).
  • Shelf life: 180 days in sealed containers with moisture barrier packaging.

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