BERGQUIST® GAP PAD TGP 7000ULM BLU is a highly conformable silicone-based thermal interface material with exceptional thermal performance. It has an ultra-low modulus, allowing for minimal compression stress and excellent heat transfer. The material features a thermal conductivity of 7.5 W/m-K and does not exhibit mobile polymer bleed. It is designed for high-performance applications requiring low assembly stress and superior surface wet-out.
| Property | Value | Test Standard |
|---|---|---|
| Physical Properties | ||
| Hardness, Shore 000 | 70 | ASTM D2240 |
| Density (g/cc) | 3.2 | ASTM D792 |
| Heat Capacity (J/g-K) | 0.8 | ASTM E1269 |
| Young’s Modulus (psi) | 36 | – |
| Shelf Life (days) | 180 | – |
| Electrical Properties | ||
| Volume Resistivity (ohm-meter) | 2×10¹⁰ | ASTM D257 |
| Dielectric Constant (1,000Hz) | 7.4 | ASTM D150 |
| Dielectric Strength (KV/mil) | 412 | – |
| Thermal Properties | ||
| Thermal Conductivity (W/m-K) | 7.5 | ASTM D5470 |
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