Industries

BERGQUIST GAP PAD TGP 6000ULM

  • Item Name: BERGQUIST GAP PAD TGP 6000ULM
  • Manufacturer: Henkel
  • Product Category: Thermal Interface Material (TIM)
  • Technologies: Silicone-based, ultra-low modulus, fiberglass-reinforced
  • Applications: Telecommunications, ASICs and DSPs, consumer electronics, thermal modules to heat sinks assembly
  • Color: Gray
  • Cure Type: Pre-cured thermal interface pad
  • Package Size: Contact Avantek for details
  • Shelf Life: 12 months

1. Product Overview

BERGQUIST GAP PAD TGP 6000ULM is a high-performance silicone thermal interface material with a thermal conductivity of 6.0 W/m-K. It features ultra-low modulus for high compliance and low compression stress. The material is highly conformal, suitable for surfaces with roughness or topography, and provides excellent interfacing and wet-out characteristics. It has inherent tack on both sides for easy assembly and rework and is reinforced with fiberglass for durability.

2. Applications

  • Telecommunications
  • ASICs and DSPs
  • Consumer electronics
  • Thermal module to heat sink assembly

3. Typical Properties

Property Value Test Standard
Physical Properties
Hardness, Shore 000 60 ASTM D2240
Heat Capacity (J/g-K) 1.0 ASTM E1269
Density (g/cc) 3.2 ASTM D792
Young’s Modulus (kPa) 41.3 (6 psi)
Flammability
UL Flammability Rating V-0 UL 94
Electrical Properties
Dielectric Strength (VAC) >5,000 ASTM D149
Dielectric Constant (1,000Hz) 6.5 ASTM D150
Volume Resistivity (ohm-meter) 1×10¹⁰ ASTM D257
Thermal Properties
Thermal Conductivity (W/m-K) 6.0 ASTM D5470
Thermal Impedance (°C-in²/W) ASTM D5470
– 10% Deflection 0.34
– 20% Deflection 0.29
– 30% Deflection 0.26

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