Industries

BERGQUIST GAP PAD TGP 2700 (Known as BERGQUIST GAP PAD 2500)

  • Item Name: BERGQUIST GAP PAD TGP 2700 (Known as BERGQUIST GAP PAD 2500)
  • Manufacturer: Henkel
  • Product Category: Thermal interface material (TIM)
  • Technologies: Silicone-based, un-reinforced gap filling material
  • Applications: Heat-generating components to heat sinks, graphics chips, processors, storage drives, communication hardware
  • Color: Light brown
  • Cure Type: Not applicable (pre-formed thermal pad)
  • Package Size: Contact Avantek for details.
  • Shelf Life: 12 months

1. Product Overview

BERGQUIST GAP PAD TGP 2700 is a thermally conductive, electrically insulating, un-reinforced gap filling material designed for thermal management applications. It provides high thermal performance and cost-effectiveness, with medium compliancy and conformability.

  • Technology: Silicone-based
  • Appearance: Light brown
  • Thickness: 0.508 to 3.175 mm (ASTM D374)
  • Operating Temperature Range: -60 to 200°C
  • Thermal Conductivity: 2.7 W/m-K
  • Features: High thermal performance, good wet-out, natural tack on both sides, fiberglass reinforcement for durability

2. Applications

  • Multiple heat-generating components to a common heat sink
  • Graphics chips, processors to heat sinks
  • Mass storage drives
  • Wireline/wireless communications hardware

3. Typical Properties

Physical Properties

Property Value Test Method
Hardness, Shore 00 80 ASTM D2240
Heat Capacity (J/g-K) 1.0 ASTM E1269
Density (g/cc) 3.1 ASTM D792
Flammability UL 94 V-0 UL 94
Young’s Modulus (kPa) 779 (113 psi) ASTM D575

Electrical Properties

Property Value Test Method
Dielectric Breakdown Voltage >6,000 VAC ASTM D149
Dielectric Constant (1,000Hz) 6.8 ASTM D150
Volume Resistivity (ohm-m) 1×10¹¹ ASTM D257

Thermal Properties

Property Value Test Method
Thermal Conductivity (W/m-K) 2.7 ASTM D5470

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