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BERGQUIST SIL PAD TSP 900 (Known as BERGQUIST SIL-PAD 400)

  • Item Name: BERGQUIST SIL PAD TSP 900 (Known as BERGQUIST SIL-PAD 400)
  • Manufacturer: Henkel
  • Product Category: Thermal interface material
  • Technologies: Silicone-based, fiberglass-reinforced thermal pad
  • Applications: Thermal management, power supplies, automotive electronics, power semiconductors, motor controls
  • Color: Gray
  • Cure Type: Not applicable (pre-formed thermal pad)
  • Package Size: Contact Avantek for details
  • Shelf Life: Contact Avantek for details

1. Product Overview

BERGQUIST SIL PAD TSP 900 is a thermally conductive insulator made of silicone rubber and fiberglass. It is flame-retardant, mechanically strong, and designed to electrically isolate power components from heat sinks while improving thermal resistance over time.

Key Features & Benefits:

  • Thermal impedance: 1.13°C-in²/W @ 50 psi
  • Excellent mechanical and electrical insulation
  • High durability & cut-through resistance
  • Flame retardant (UL 94 V-0)
  • Non-toxic & chemical resistant

2. Applications

  • Power supplies
  • Automotive electronics
  • Power semiconductors
  • Motor controls

3. Typical Properties

Physical Properties

Property Test Method Value
Hardness (Shore A) ASTM D2240 85
Breaking Strength (KN/m) ASTM D1458 5
Elongation (%) ASTM D412 54
Tensile Strength (MPa) ASTM D412 20
Flammability Rating UL 94 V-0

Electrical Properties

Property Test Method Value
Dielectric Breakdown Voltage (Vac) ASTM D149 3,500 – 4,500
Dielectric Constant @1,000 Hz ASTM D150 5.5
Volume Resistivity (ohm-meter) ASTM D257 1×10¹¹

Thermal Properties

Property Test Method Value
Thermal Conductivity (W/m-K) ASTM D5470 0.9

Thermal Performance vs. Pressure (TO-220, °C/W)

Pressure (psi) @ 0.007″ @ 0.009″
10 6.62 8.51
25 5.93 7.62
50 5.14 6.61
100 4.38 5.63
200 3.61 4.64

Thermal Impedance (°C-in²/W, ASTM D5470)

Pressure (psi) @ 0.007″ @ 0.009″
10 1.82 2.34
25 1.42 1.83
50 1.13 1.45
100 0.82 1.05
200 0.54 0.69

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