BERGQUIST BOND PLY TBP 850 (also known as BERGQUIST BOND-PLY 100) is a thermally conductive, fiberglass-reinforced, pressure-sensitive adhesive tape. It provides high bond strength and is designed to efficiently transfer heat while offering easy application due to its double-sided adhesive nature.
✔ Key Features & Benefits:
✅ Mounting heat sinks onto BGA graphic processors and drive processors
✅ Mounting heat spreaders onto power converter PCBs or motor control PCBs
| Property | Test Method | Value |
|---|---|---|
| Total Thickness (mm) | ASTM D374 | 0.127, 0.203, 0.279 |
| Temperature Coefficient of Resistance (°C) | – | 200 |
| Elongation (%) | ASTM D412 | 70 |
| Coefficient of Thermal Expansion (ppm) | ASTM D3386 | 325 |
| Glass Transition Temperature (°C) | ASTM D1356 | -30 |
| Flammability Rating | UL 94 | V-0 |
| Tensile Strength (MPa) | ASTM D412 | 6 (900 psi) |
| Property | Test Method | Value |
|---|---|---|
| Lap Shear Strength @ 25°C (MPa) | ASTM D1002 | 0.7 (100 psi) |
| After 5 hours @ 100°C (MPa) | ASTM D1002 | 1.4 (200 psi) |
| After 2 minutes @ 200°C (MPa) | ASTM D1002 | 1.4 (200 psi) |
| Static Dead Weight Shear Strength (°C) | PSTC#7 | 150 |
| Property | Test Method | Value |
|---|---|---|
| Dielectric Breakdown Voltage @ 0.005″ (Vac) | ASTM D149 | 3,000 |
| Dielectric Breakdown Voltage @ 0.008″ (Vac) | ASTM D149 | 6,000 |
| Dielectric Breakdown Voltage @ 0.011″ (Vac) | ASTM D149 | 8,500 |
| Property | Test Method | Value |
|---|---|---|
| Thermal Conductivity (W/m-K) | ASTM D5470 | 0.8 |
| Thickness | Pressure (psi) | TO-220 Thermal Performance (°C/W) | Thermal Impedance (°C-in²/W) |
|---|---|---|---|
| 0.005″ | 10 | 5.17 | 0.56 |
| 25 | 4.87 | 0.54 | |
| 50 | 4.49 | 0.52 | |
| 100 | 4.18 | 0.50 | |
| 200 | 4.10 | 0.50 | |
| 0.008″ | 10 | 5.4 | 0.82 |
| 25 | 5.35 | 0.80 | |
| 50 | 5.28 | 0.78 | |
| 100 | 5.22 | 0.77 | |
| 200 | 5.20 | 0.75 | |
| 0.011″ | 10 | 6.59 | 1.03 |
| 25 | 6.51 | 1.02 | |
| 50 | 6.51 | 1.01 | |
| 100 | 6.50 | 1.00 | |
| 200 | 6.40 | 0.99 |
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
As the year draws to a close and the Christmas season arrives, Avantek Viet Nam would like to extend our warmest Christmas greetings to all our valued customers, partners, and friends.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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