Industries

BERGQUIST HI FLOW THF 1600G

  • Item Name: BERGQUIST HI FLOW THF 1600G
  • Manufacturer: Henkel
  • Product Category: Phase Change Thermal Interface Material
  • Technologies: Phase Change with fiberglass reinforcement
  • Applications: Thermal management for computer processors, peripherals, and bare die heat sinking
  • Color: Green
  • Cure Type: Phase change (activation at 55°C; no additional curing required)
  • Package Size: Contact to Avantek for details
  • Shelf Life: Contact to Avantek for details

1. Product Overview

BERGQUIST HI FLOW THF 1600G is a fiberglass-reinforced, phase change thermal interface material designed for efficient heat transfer between electronic components and heat sinks. It features a phase change compound that activates at 55°C, ensuring low thermal impedance and stable performance.

2. Applications

  • Thermal management in computer processors and peripherals
  • Interface for bare die components requiring heat dissipation
  • Alternative to thermal grease, preventing dripping and running

3. Typical Properties

Property Value Test Method
Physical Properties
Elongation 40% ASTM D882A
Tensile Strength 3 MPa ASTM D882A
Phase Change Temperature 55°C ASTM D3418
Flammability Rating UL 94 V-0
Electrical Properties
Dielectric Breakdown Voltage 300V ASTM D149
Dielectric Constant (@1,000 Hz) 3.5 ASTM D150
Volume Resistivity 1×10⁸ Ω-m ASTM D257
Thermal Properties
Thermal Conductivity 1.6 W/m-K ASTM D5470
Thermal Performance vs. Pressure
TO-220 Thermal Resistance (°C/W)
@ 10 psi 0.96
@ 25 psi 0.92
@ 50 psi 0.88
@ 100 psi 0.85
@ 200 psi 0.84
Thermal Impedance (°C-in²/W) ASTM D5470
@ 10 psi 0.27
@ 25 psi 0.2
@ 50 psi 0.16
@ 100 psi 0.15
@ 200 psi 0.14

4. Application Methods

  • Hand-apply at 40°- 50°C: Heat the heat sink and apply the material like an adhesive pad.
  • Hand-apply at 20°- 35°C: Use a foam roller with 30 psi pressure to affix the material.
  • Automated equipment application: A pick-and-place unit with 30 psi pressure can be used.

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