FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brand: Insulcast
Package Sizes: Contact us for details.
Shelf Life: 12 months
Insulcast RTVS 3-95-1 is a low-viscosity, thermally conductive RTV silicone compound that is UL recognized (File E86165) for flame class 94V-0. It is specifically designed for potting and encapsulation applications, offering high dielectric strength, excellent thermal conductivity, and a broad service temperature range (-55°C to +260°C). The product provides flexibility and environmental resistance, making it suitable for demanding industrial and electronic applications.
✅ Low Viscosity: Allows for easy flow into complex geometries.
✅ Thermally Conductive: Provides 1.0 W/m·K thermal conductivity for heat dissipation.
✅ UL 94V-0 Flame Retardant: Enhances fire safety compliance.
✅ Broad Service Temperature Range: Operates from -55°C to +260°C without degradation.
✅ High Electrical Insulation Properties: Ensures reliable dielectric performance.
🔹 Electronic Potting & Encapsulation: Protects PCBs, transformers, and sensitive components.
🔹 Industrial Electronics: Suitable for high-temperature and thermally demanding applications.
🔹 Aerospace & Automotive Components: Used in vibration-resistant, thermally stable electronics.
🔹 Heat Management Systems: Ensures effective thermal dissipation in power electronics.
| Property | Part A | Part B | Mixed | Test Standard |
|---|---|---|---|---|
| Color | Red | Clear | – | Visual |
| Viscosity (cP) | 15,000 | 1,000 | 10,000 | ASTM D2393 |
| Specific Gravity | 2.35 | 0.96 | – | – |
| Mix Ratio (by Weight) | 100:5 | – | – | – |
| Pot Life (100g mass) | – | – | 1.5 hours | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness (Shore A) | 65 | ASTM D2240 |
| Tensile Strength (psi) | 475 | ASTM D412 |
| Elongation at Break (%) | 45 | ASTM D412 |
| Tear Strength (Die B) (lb/in) | 15 | ASTM D624 |
| Thermal Conductivity (W/m·K) | 1.0 | – |
| Coefficient of Thermal Expansion (°C⁻¹) | 18 × 10⁻⁵ | – |
| Service Temperature Range (°C) | -55 to +260 | – |
| Property | Value | Test Standard |
|---|---|---|
| Dielectric Strength (V/mil) | 500 | ASTM D149 |
| Dielectric Constant (1 kHz) | 5.0 | ASTM D150 |
| Dissipation Factor (1 kHz) | 0.005 | ASTM D150 |
| Volume Resistivity (ohm-cm) | 5 × 10¹⁴ | ASTM D257 |
| Cure Method | Time & Temperature |
|---|---|
| Room Temperature Cure | 24 hours at 25°C (77°F) |
| Accelerated Cure | 4 hours at 50°C (122°F) |
| Rapid Cure | 1 hour at 90°C (194°F) |
| High-Speed Cure | 15 minutes at 125°C (257°F) |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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