Applications

LOCTITE 3621

  • Item Name: LOCTITE 3621
  • Manufacturer: Henkel
  • Product Category: Surface Mount Adhesive
  • Technologies: Epoxy-based, Heat Cure
  • Applications: Bonding surface-mounted devices (SMD) to printed circuit boards (PCB) before wave soldering, small parts bonding
  • Color: Red (viscous gel)
  • Cure Type: Heat cure (typically 90-120 seconds at 150°C)
  • Package Size: Contact Avantek for details.
  • Shelf Life: Contact Avantek for details.

1. Product Overview

LOCTITE 3621 is a one-component, heat-curing epoxy adhesive designed for bonding surface-mounted devices (SMDs) to printed circuit boards (PCBs) before wave soldering. It offers high wet strength, excellent electrical characteristics, and is particularly suited for high-speed dispensing applications (>35,000 dots/h). The adhesive is compatible with lead-free soldering processes using water- and alcohol-based fluxes.


2. Applications

  • Bonding SMD components to PCBs
  • Small parts bonding
  • High-speed dispensing applications (25,000 – 50,000 dots/h)

3. Typical Properties

Uncured Material

Property Value
Specific Gravity (25°C) 1.22
Yield Point (Pa) 130 – 280
Casson Viscosity (Pa∙s) 0.5 – 3
Particle Size (µm) <150
Appearance Red viscous gel

Curing Performance

Condition Cure Time
150°C 90 – 120 sec
125°C 5 min (≥90% cure conversion)
150°C 30 min (full cure)

Cured Material

Property Value
Glass Transition Temp (°C) 110
Thermal Conductivity (W/m·K) 0.3
Density (g/cm³) 1.16
Coefficient of Thermal Expansion (K⁻¹) 100×10⁻⁶ (25–70°C) / 218×10⁻⁶ (90–150°C)

Electrical Properties

Property Value
Volume Resistivity (Ω·cm) 1.3×10¹⁵
Surface Resistivity (Ω) 52×10¹⁵
Dielectric Breakdown Strength (kV/mm) 40
Dielectric Constant (1kHz) 2.94

Adhesive Strength

Test Condition Strength
Pull-off Strength (C-1206 on FR4) 50 N (13 lb)
Torque Strength (C-1206 on FR4) 60 N·mm (9.6 in.oz)
Push-off Strength (3 min @150°C) ≥27 N (≥6.0 lb)
Lap Shear Strength (Mild Steel) ≥15 N/mm² (≥2,175 psi)

Environmental Resistance

  • Hot Strength: Maintains strength up to 150°C
  • Resistance to Hot Solder Dip: Passes 260°C wave solder test
  • Surface Insulation Resistance (SIR): Retains high electrical insulation after 1000 hours at 85°C/85% RH

4. Storage & Handling

  • Store between 2°C – 8°C
  • Floor life at 22°C – 28°C: 1 month
  • Allow 2–4 hours to reach room temperature before use
  • Ideal dispensing temperature: 30°C – 35°C
  • Clean uncured adhesive with isopropanol, MEK, or ester blends (e.g., LOCTITE® 7360™)

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