LOCTITE 3611 is a one-component, red epoxy adhesive designed for bonding surface-mounted devices (SMDs) to printed circuit boards before wave soldering. It provides very high wet strength and fast curing on high-speed SMT lines. Its low moisture absorption allows extended exposure to humidity without affecting dispensability or causing void formation.
| Property | Value |
|---|---|
| Uncured Properties | |
| Appearance | Red viscous gel |
| Specific Gravity @ 25°C | 1.3 |
| Yield Point (Pa) | 125 – 400 |
| Casson Viscosity (Pa∙s) | 20 – 50 |
| Fluorescence | Positive under UV light |
| Curing Performance | |
| Recommended Cure | 90-120s @ 150°C |
| Isothermal DSC Conversion (5 min @ 125°C) | 95-100% |
| Cured Properties | |
| Coefficient of Thermal Expansion (K⁻¹) | 70 × 10⁻⁶ |
| Thermal Conductivity (W/m·K) | 0.4 |
| Specific Heat (kJ/kg·K) | 0.3 |
| Density @ 25°C (g/cm³) | 1.4 |
| Glass Transition Temperature (°C) | 73 |
| Electrical Properties | |
| Dielectric Constant (1 kHz) | 3.3 |
| Volume Resistivity (Ω·cm) | 2 × 10¹⁵ |
| Surface Resistivity (Ω) | 50 × 10¹⁵ |
| Mechanical Performance (Cured) | |
| Pull-off Strength (N) | 22 – 46 |
| Torque Strength (N·mm) | 33 – 63 |
| Push-off Strength (N) | ≥30 |
| Lap Shear Strength (Steel, N/mm²) | ≥15 |
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Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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