
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Insulbond 5-171-1 is a two-part epoxy adhesive designed for high-strength bonding and encapsulation. It offers excellent thermal conductivity and electrical insulation, making it ideal for electronic, aerospace, and industrial applications. This epoxy provides superior adhesion to metals, ceramics, and plastics, ensuring durability in demanding environments.
✅ High Bond Strength: Strong adhesion to metals, ceramics, and plastics.
✅ Excellent Electrical Insulation: Suitable for electronic applications.
✅ Good Thermal Conductivity: Enhances heat dissipation in bonded components.
✅ Versatile Curing Options: Cures at room temperature or with heat acceleration.
✅ Chemical & Solvent Resistance: Withstands exposure to harsh industrial environments.
🔹 Electronic Encapsulation: Ideal for potting and sealing electronic components.
🔹 Industrial Bonding: Used in metal, ceramic, and composite bonding.
🔹 Aerospace & Automotive: Provides high-performance adhesive strength for critical applications.
🔹 Thermal Management Applications: Effective for bonding heat-sensitive components.
| Property | Value | Test Standard |
|---|---|---|
| Color | Gray | – |
| Viscosity (Mixed) | 8,000 – 12,000 cP | ASTM D2196 |
| Mix Ratio (by Weight) | 100:12 | – |
| Mix Ratio (by Volume) | 10:1 | – |
| Pot Life | 60 minutes | – |
| Property | Value | Test Standard |
|---|---|---|
| Hardness | 80 Shore D | ASTM D2240 |
| Specific Gravity | 1.45 | ASTM D792 |
| Lap Shear Strength | 2,800 psi (19.3 MPa) | ASTM D1002 |
| Thermal Conductivity | 1.3 W/m·K | ASTM C177 |
| Dielectric Strength | 400 V/mil | ASTM D149 |
| Service Temperature | -55°C to 150°C | – |
| Cure Time (Functional) | 24 hours at 25°C | – |
| Full Cure Time | 7 days at 25°C or 2 hours at 80°C | – |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

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Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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