LOCTITE ECCOBOND LA 3032-78 is a one-component, heat-curing epoxy encapsulant designed for high-throughput assembly operations. It features:
Ideal for: Inkjet applications and MEMS devices.
| Property | Value |
|---|---|
| Appearance | Yellow |
| Viscosity (Casson, 50 s⁻¹) | 50,000 mPa·s (cP) |
| Shear Thinning Index | 3.0 |
| Density | 1.32 g/cm³ |
| Shelf Life (@ 0°C) | 60 days |
| Cure Schedule | Time & Temperature |
|---|---|
| Heat Cure | 15 min @ 100°C |
| Rapid Cure | 3 min @ 120°C |
| Fastest Cure | 45 sec @ 160°C |
| Property | Value |
|---|---|
| Hardness (Shore D) | >84 |
| Glass Transition Temperature (Tg) | 110°C |
| Storage Modulus (25°C) | 3,700 N/mm² (536,639 psi) |
| DSC Onset Temperature | 116°C |
| DSC Peak Temperature | 125°C |
| Enthalpy | 285 J/g |
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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