Applications

LOCTITE® ECCOBOND UF 3711

  • Item Name: LOCTITE® ECCOBOND UF 3711
  • Manufacturer: Henkel Corporation
  • Product category: Epoxy Adhesive for Electronics
  • Technologies: Epoxy technology with UV curability
  • Applications: Edgebond, encapsulation, and active alignment
  • Color: White paste
  • Cure type: UV cure or UV + heat cure
  • Package size: Contact to Avantek for details.
  • Shelf life: 365 days (when stored at -20°C)

1. Product Overview

LOCTITE® ECCOBOND UF 3711 is a UV-curable, thixotropic, low-CTE epoxy adhesive designed for edgebonding, encapsulation, and active alignment applications. It enhances chip reliability, providing a uniform, void-free encapsulant that improves thermal cycling performance and distributes stress away from solder joints.

2. Applications

  • Edgebonding
  • Encapsulation
  • Active alignment

3. Typical Properties

Uncured Properties

Property Value
Viscosity @ 25°C (mPa.s) 35,000
Thixotropic Index 4.6
Specific Gravity 1.78 g/cc
Work Life 72 hours
Shelf Life (-20°C) 365 days

Curing Performance

  • UV Cure: 365 nm UV LED, 700 mW/cm², 7,000 mJ/cm²
  • Secondary Heat Cure (for shadowed areas or >4mm depth):
    • 120°C for ≥10 min
    • 100°C for ≥20 min
    • 80°C for ≥40 min

Cured Properties

Property Value
CTE (α1/α2) 20 / 62 μm/m/K
Glass Transition Temperature (Tg) 150°C
Tensile Modulus @ 25°C 13.6 GPa
Cure Shrinkage (Volume) 1.4%
Water Absorption (168h, 85°C/85%RH) 1.1%

Electrical Properties

Property Value
Dielectric Constant / Dissipation Factor @ 5 GHz 3.3 / 0.0108
Volume Resistivity 2.91×10¹⁵ Ω·cm
Dielectric Breakdown Strength 24 kV/mm

Mechanical Performance

Property Value
Die Shear Strength (3×3 Glass Die to FR4) >12 kgf (>1,740 psi)

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