LOCTITE® ECCOBOND UF 3711 is a UV-curable, thixotropic, low-CTE epoxy adhesive designed for edgebonding, encapsulation, and active alignment applications. It enhances chip reliability, providing a uniform, void-free encapsulant that improves thermal cycling performance and distributes stress away from solder joints.
| Property | Value |
|---|---|
| Viscosity @ 25°C (mPa.s) | 35,000 |
| Thixotropic Index | 4.6 |
| Specific Gravity | 1.78 g/cc |
| Work Life | 72 hours |
| Shelf Life (-20°C) | 365 days |
| Property | Value |
|---|---|
| CTE (α1/α2) | 20 / 62 μm/m/K |
| Glass Transition Temperature (Tg) | 150°C |
| Tensile Modulus @ 25°C | 13.6 GPa |
| Cure Shrinkage (Volume) | 1.4% |
| Water Absorption (168h, 85°C/85%RH) | 1.1% |
| Property | Value |
|---|---|
| Dielectric Constant / Dissipation Factor @ 5 GHz | 3.3 / 0.0108 |
| Volume Resistivity | 2.91×10¹⁵ Ω·cm |
| Dielectric Breakdown Strength | 24 kV/mm |
| Property | Value |
|---|---|
| Die Shear Strength (3×3 Glass Die to FR4) | >12 kgf (>1,740 psi) |
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Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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