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TECHNOMELT® PA 652 N

  • Item Name: TECHNOMELT® PA 652 N
  • Manufacturer: Henkel Corporation
  • Product category: Hotmelt Adhesive (Molding)
  • Technologies: Polyamide Thermoplastic, One-Component
  • Applications: Molding, especially for low pressure processes and encapsulation of fragile components
  • Color: Amber
  • Cure type: Physical setting
  • Package size: Contact to Avantek for details.
  • Shelf life: Contact to Avantek for details.

1. Product Overview

TECHNOMELT® PA 652 N is a high-performance thermoplastic polyamide hotmelt adhesive designed for low-pressure molding applications. It has low viscosity, allowing encapsulation of fragile components without damage. This product offers excellent adhesion and cold-temperature flexibility.

  • Technology: Polyamide
  • Product Type: Hotmelt
  • Condition: Thermoplastic
  • Components: One-component
  • Cure Method: Physical setting
  • Operating Temperature Range: -40°C to 100°C (application dependent)
  • UL 94 V-0 Flame Retardancy Certified

2. Applications

  • Encapsulation of fragile electronic components
  • Low-pressure molding applications requiring excellent adhesion
  • Applications requiring cold-temperature flexibility
  • Used where UL 94 V-0 flame retardancy is necessary

3. Typical Properties

Uncured Properties

Property Value Test Method
Density @ 20°C (g/cm³) 0.98
Softening Point (°C) 150 – 165 ASTM E28
Melting Viscosity (mPa·s) at: ASTM D-3236
– 180°C 9,500
– 190°C 7,000
– 200°C 5,400
– 210°C 4,000

Cured Properties

Property Value Test Method
Hardness (Shore A) 77 ISO 868/15s
Elongation (%) 400 ISO 527
Yield Strength (N/mm² / psi) 2.6 / 377 ISO 527
Breaking Strength (N/mm² / psi) 2.7 / 392 ISO 527
Temperature Creep Resistance (°C) 125 Henkel Method 11
Low Temperature Flexibility (°C) -50 ASTM D3111
Glass Transition Temperature (°C) -45 DSC

Electrical Properties

Property Value
Volume Resistivity (Ω·cm) 1×10¹²
Dielectric Strength (kV/mm) >14

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