Applications

H. B. Fuller EA6107 UV Adhesive for FPCB Bonding

  • Technology: UV/Moisture Curable Adhesive
  • Brand Name: H.B. Fuller EA6107
  • Manufacturer: H.B. Fuller
  • Package Size: Not specified in the provided data (needs confirmation)
  • Shelf Life: 6 months

H.B. Fuller EA6107 UV Adhesive for FPCB Bonding

1. Product Overview

H.B. Fuller EA6107 is a high-performance, dual-cure adhesive designed for bonding flexible printed circuit boards (FPCBs) and other electronic applications. It features both UV and moisture curing, enabling strong adhesion in shadowed areas where UV light cannot reach. The adhesive offers rapid initial curing under UV light, followed by continued strength development through moisture exposure. Its high viscosity and controlled flow characteristics make it suitable for precision bonding without excessive spreading.

2. Applications

  • Bonding of Flexible Printed Circuit Boards (FPCBs) to various substrates
  • Adhesion of plastics and metals in electronic assemblies
  • Encapsulation and protection of electronic components
  • Structural bonding in applications requiring UV/moisture dual curing

3. Typical Properties

Property Value
Appearance Blue liquid
Component Acrylate-based
Viscosity @ 25°C 12,800 cP (Spindle 52, 5 rpm)
Thixotropic Index 5.1
Density 1.05 g/cm³
Curing Method UV + Moisture
UV Cure 100 mW/cm² @ 365nm for 30s
Moisture Cure Occurs at ambient humidity
Tack-Free Time < 15 sec (UV cure)
Depth of Cure 8 mm @ 30s UV exposure
Shore D Hardness 20 (initial), increases to 70 after 7 days moisture cure
Storage Temperature 2°C to 8°C
Shelf Life 6 months (unopened)

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