FX219G5 – Silicone Potting & Encapsulation Compound
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
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Brands: Scotch-Weld™
Package Sizes:
Shelf Life: 24 months
3M™ Scotch-Weld™ Epoxy Adhesive 2216 B/A Translucent is a flexible, two-part, room temperature curing epoxy with high peel and shear strength. It is designed for bonding metals, woods, plastics, rubbers, and masonry products. This adhesive has excellent resistance to extreme shock, vibration, and flexing and is suitable for cryogenic bonding applications.
| Attribute | Value |
|---|---|
| Mix Ratio by Weight (B:A) | 1:1 |
| Mix Ratio by Volume (B:A) | 1:1 |
| Base Color | Translucent |
| Accelerator Color | Amber |
| Base Resin | Modified Epoxy |
| Accelerator Resin | Modified Amine |
| Base Net Weight | 9.4 — 9.8 lb/gal |
| Accelerator Net Weight | 8.0 — 8.5 lb/gal |
| Base Viscosity (23°C / 73°F) | 11,000-15,000 cP¹ |
| Accelerator Viscosity (23°C / 73°F) | 5,000-9,000 cP¹ |
¹ Measured with Brookfield RVF #7 spindle at 20 rpm.
| Attribute | Temperature | Value |
|---|---|---|
| Open Time | – | 120 min¹ |
| Work Life (100g mixed) | 23°C (73°F) | 120 min |
| Time to Handling Strength | 23°C (73°F) | 12 — 16 h |
| Time to Full Cure | 23°C (73°F) | 30 days |
| Time to Full Cure | 66°C (150°F) | 240 min |
| Time to Full Cure | 93°C (200°F) | 60 min |
¹ Maximum time allowed after applying adhesive before bond must be closed.
| Attribute | Test Method | Temperature | Value |
|---|---|---|---|
| Shear Modulus (Etched Aluminum) | ASTM D1002, ISO 4587 | -100°C (-148°F) | 2745 MPa (398,000 psi) |
| Shear Modulus (Etched Aluminum) | ASTM D1002, ISO 4587 | -60°C (-76°F) | 2199 MPa (318,855 psi) |
| Shear Modulus (Etched Aluminum) | ASTM D1002, ISO 4587 | -40°C (-40°F) | 1947 MPa (282,315 psi) |
| Shear Modulus (Etched Aluminum) | ASTM D1002, ISO 4587 | 23°C (73°F) | 342 MPa (49,580 psi) |
| Shore D Hardness | ASTM D2240 | 23°C (73°F) | 42 |
| Attribute | Test Method | Temperature | Value |
|---|---|---|---|
| T-Peel Adhesion | ASTM D1876 | 23°C (73°F) | 25 lb/in |
| Attribute | Test Condition | Value |
|---|---|---|
| Coefficient of Thermal Expansion | -50 ~ 0°C | 81 x 10⁻⁶ m/m/°C |
| Coefficient of Thermal Expansion | 60 ~ 150°C | 207 x 10⁻⁶ m/m/°C |
| Thermal Conductivity | – | 0.114 (btu-ft)/(h-ft²-°F) |
| Dielectric Constant | ASTM D150, 1 KHz | 6.3 |
| Dissipation Factor | ASTM D150, 1 KHz | 0.119 |
| Volume Resistivity | ASTM D257 | 3.0 x 10¹² Ω-cm |
Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.
FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
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We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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