Applications

KYZEN® E5631

  • Brand Name: KYZEN® E5631

  • Package Size: Available in 1 Gallon, 5 Liters*, 5 Gallons, 25 Liters*, 55 Gallons, and 200 Liters*. (*Liters available in South Asia and Europe.)

  • Shelf Life: 5 years in sealed containers of 5 Gallons / 25 Liters or more.

1. Product Overview

KYZEN® E5631 is a next-generation stencil and misprinted board cleaner designed to remove raw solder paste, flux, and uncured adhesives. It is formulated for spray-in-air and ultrasonic cleaning processes, ensuring effective cleaning at low concentrations while maintaining material compatibility in electronic assembly.


2. Applications

  • Stencil Cleaning: Removes raw solder paste and uncured adhesives.
  • Misprinted Board Cleaning: Effective for misprinted PCB assemblies.
  • Electronic Assembly Manufacturing: Compatible with various stencil materials and cleaning equipment.

 

3. Typical Properties

Property Value
pH (10g/L solution) N/A
Flash Point None to boiling
Boiling Point 220°F (104°C)
Water Solubility Partial
VOC (10%) 87.4 g/L
Application Method Spray-In-Air & Ultrasonics
Operating Concentration <25%
Operating Temperature Ambient – 120°F (49°C)
Rinsing Requirement Recommended (DI Water)
Drying Method Hot Air
Storage Temperature 5-50°C (41-122°F)
Shelf Life 5 years (sealed containers ≥5 gallons)

4. Environmental, Health, and Safety Regulations

  • Non-Hazardous, Biodegradable
  • Low VOC, No CFCs or Hazardous Air Pollutants (HAPs)
  • ISO 9001:2015 Certified

Everwide FX244-1: High Performance for Precision Molding

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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