
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Dymax SpeedMask® 9-20479-B-REV-A Blue PCB Protective Maskant cures upon exposure to light and is designed for rapid masking of electronic components and assemblies. The mask is easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods. SpeedMask resins contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax light- curing spot lamps, focused-beam lamps, or flood lamps, they deliver optimum speed and performance for masking. Dymax lamps offer the ideal balance of UV and visible light for the fastest, deepest cures. This product is in full compliance with RoHS directives 2015/863/EU.
| UNCURED PROPERTIES * | ||
| Property | Value | Test Method |
| Solvent Content | No Nonreactive Solvents | N/A |
| Chemical Class | Acrylated Urethane | N/A |
| Appearance | Blue Translucent Gel | N/A |
| Soluble in | Organic Solvents | N/A |
| Density, g/ml | 1.13 g/ml | ASTM D1875 |
| Viscosity, cP | 115,000 (nominal) | DSTM 502‡ |
| Shelf Life at Recommended Conditions from Date of Manufacture |
9 months |
N/A |
| CURED MECHANICAL PROPERTIES * | ||
| Property | Value | Test Method |
| Durometer Hardness | A75 | ASTM D2240 |
| Tensile at Break, MPa [psi] | 3.37 [490] | ASTM D638 |
| Elongation at Break, % | 140 | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 4.13 [600] | ASTM D638 |
| Glass Transition Tg, °C | 18 | ASTM D5418 |
| Surface Insulation Resistance (SIR) Testing | Pass | IPC-TM-650
Method 2.6.7 |
| OTHER CURED PROPERTIES * | ||
| Property | Value | Test Method |
| Boiling Water Absorption, % (2 hr) | 6 | ASTM D570 |
| Water Absorption, % (25°C, 24 hr) | 6 | ASTM D570 |
| Linear Shrinkage, % | 1.6 | ASTM D2566 |
| CURING EQUIPMENT RECOMMENDATIONS * | |||
| Process Method | Spot Lamp | Flood Lamp | Conveyor |
|
LED Curing/Wavelength |
BlueWave® MX- 150
PrimeCure® (385 nm) |
BlueWave® AX- 550 PrimeCure®
(385 nm) |
UVCS Conveyor with LED Floods |
| Broad Spectrum | BlueWave® 200 | 5000-ECE or
PortaRay 400 |
UVCS Conveyor with Fusion F300S |
| ADHESION | |||
| Substrate | Recommendation | ||
| Lead Frame | |||
| Ceramic | |||
| PCB | |||
| Flex | |||
| Silicon | |||

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
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