
High Performance Epoxy for Drone Manufacturing
Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding
Dymax 4-20418-GEL Low-Stress Plastic and Glass Bonder adhesive provides rapid bonding and laminating to glass, metal, and many plastics such as ABS, acrylics, polycarbonate, polyurethane, and styrene. This solvent-free, visible and/or UV-curable adhesive dispenses easily and cures quickly for precise quantity and placement of adhesive. Bonds resist yellowing in the sun and demonstrate good performance in thermal cycling. This product is in full compliance with RoHS directives 2015/863/EU.
Used to bond:
| TYPICAL UNCURED PROPERTIES * | ||
| Property | Value | Test Method |
| Solvent Content | No Nonreactive Solvents | N/A |
| Chemical Class | Acrylated Urethane | N/A |
| Appearance | Colorless | N/A |
| Soluble in
Viscosity, cP (20 rpm) |
Organic Solvents
35,000 |
N/A
ASTM D1084 |
| Shelf Life at Recommended Conditions from Date of Manufacture |
18 months |
N/A |
| CURED MECHANICAL PROPERTIES * | ||
| Property | Value | Test Method |
| Durometer Hardness | D60 | ASTM D2240 |
| Tensile at Break, MPa [psi] | 11.4 [1,650] | ASTM D638 |
| Elongation at Break, % | 130% | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 689.5 [100,000] | ASTM D638 |
| OTHER CURED PROPERTIES * | ||
| Property | Value | Test Method |
| Boiling Water Absorption, % (2 h) | 4.4 | ASTM D570 |
| Water Absorption, % (25°C, 24 h) | 4.1 | ASTM D570 |
| Coefficient of Thermal Expansion | 95 x 10-6 in/in/°C | ASTM E831 |
| TYPICAL PERFORMANCE OF CURED MATERIAL * | ||
| Property | Value | Test Method |
| Glass-to-Stainless Steel Compression, psi | 2,250 (glass shatters) | DSTM 251‡ |
| Glass-to-Glass Compression, psi | 2,750 (glass shatters) | DSTM 250‡ |

Advanced Epoxy Adhesive Solutions for Next-Generation UAVs and Drones As UAV and drone technology continues to evolve, manufacturers require adhesive solutions that can withstand demanding

Stronger Bonding. Cleaner Process. Reliable Performance. If you are looking for an adhesive that combines high adhesion strength, flexibility, and electronic safety, 3320-80 is the

Everwide FX219G5 Silicone Potting Compound – high-thermal, UL94 V-0 silicone potting for electronic modules. Compare with Shin-Etsu KET-132 silicone potting.

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.
Avantek Viet Nam is a dynamic MRO, direct materials and equipment supplier that brings advanced technological solutions to maximize satisfaction of customers.
We are expert in import and export of adhesives, accessories and equipment in both domestic and cosmetic industrial fields, production and technology research and development.
Our solutions promise to bring best optimal effectiveness along with competitive prices, excellent customer services, dedicated on-site support.
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