Applications

Born2Bond™ Ultra K85 MV

LOW-ODOR, LOW-BLOOMING, INSTANT ADHESIVE

Manufacturer: Bostik

Package size:Bottles: 20g and 500g

Shelf Life: 12 months

Born2BondTM  Ultra K85 MV adhesive  is  low-odor, low-blooming,  instant  adhesive,  specially  designed to meet the  demands  of  cutting-edge  product designers and manufacturers looking for more durability and increased ease of dispensing. The formulation consistency has been designed for  high  bond strength,  even  in  places  that  are subject  to flexing. Born2BondTM Ultra K85 is made from up to 60% bio-based content and has an exceptional resistance to humidity and high temperatures.

KEY FEATURES

  • Fixture time: 15 seconds*
  • High bonding strength
  • Low blooming
  • Less brittle than conventional instant adhesives
  • Bonds a large range of materials**
  • Transparent and easy to use
  • 60% biobased
  • High humidity and water resistance

APPLICATIONS

Typical  applications  for  this  product  are MRO, general assembly, toy manufacturing and prototyping, outdoors, medical devices, automotive and consumer electronics.

PRODUCT CHARACTERISTICS

Base tehnology n-Heptyl Cyanoacrylate
Components 1k – 2k 1k
Appearance/Color Transparent
Temperature Use Range -40°C to 100°C (-40°F to 212°F)
VOC Content (ISO 11890-2) 63 g/L

UNCURED PHYSICAL PROPERTIES

Viscosity at 25°C (77°F)*

*based on Brookfield viscometer: Brookfield, 25 °C, Spindle 52z, 100 rpm

140 – 200 cP
Specific Gravity

(ASTM D1875: 23°C / 73.4°F

0.97 g/mL
Refractive Index, ABBE 1.45

CURED PHYSICAL PROPERTIES

Soft Point – HDT (ASTM E2092-18a) 48.2°C (118.8°F)
Glass Transition Temperature (ISO 6721) 92°C (197.6°F)
Coefficient of Linear Thermal Expansion (ISO 10545-8) 6.53 x 10-5°C-1
Water Absorption (after 24 hrs) (ASTM D570-98) 0.24%
Impact Resistance (after 24 hrs) (ISO 9653) 4.0 kJ/m2
Corrected Dissipation Factor, Dielectric Constant (ASTM D150-22)
D @ 1 kHz 0.028
k’ @ 1 kHz 2.788
D @ 1 MHz 0.023
k’ @ 1 MHz 2.496

 

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