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DOWSIL™ TC-5888 Thermally Conductive Compound

  • Brand Name: DOWSIL™ TC-5888 Thermally Conductive Compound

  • Package Size: Available in 1 kg cans and 140 kg drums.

  • Shelf Life: 12 months from the date of manufacture.

DOWSIL™ TC-5888 Thermally Conductive Compound is a one-part, gray, non-curing silicone-based material engineered to facilitate efficient heat dissipation in electronic components. Its thixotropic nature ensures low slump, making it ideal for applications requiring precise material placement. The solvent-free formulation maintains material stability over time, allowing for consistent performance without the need for curing.

 

Applications

This thermally conductive compound is specifically designed for:

  • Cooling modules in computer microprocessor units (MPUs)
  • Power modules
  • Other electronic components where efficient thermal transfer is essential

Its properties make it suitable for screen printing, stencil printing, and dispensing methods, ensuring versatility in various manufacturing processes.

 

DOWSIL™ TC-5888 Thermally Conductive Compound

Typical Properties

Property Unit Value
Color Gray
One-Part Material Non-curing
Viscosity at Low Strain Rate Pa·s 1,200
Viscosity at High Strain Rate Pa·s 100
Specific Gravity 2.6
Volatile Content (48 hours at 125°C) % 0.02
Thermal Conductivity W/m·K 5.2
Thermal Resistance at 25 N/cm² °C·cm²/W 0.05
Bond Line Thickness at 25 N/cm² mm (inch) 0.02 (0.0008)

Everwide FX244-1: High Performance for Precision Molding

FX244-1 A specialized two-part silicone rubber designed for creating high-precision molds. This material features a unique oil-bleeding property that creates a self-releasing surface, eliminating the need for external non-stick sprays during demolding.

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