DOWSIL™ TC-6020 Thermally Conductive Encapsulant:

1. Features & Benefits

1. High Thermal Conductivity

   • Formulated to effectively transfer heat away from sensitive electronic components, helping reduce the risk of overheating.

2. Two‐Part Silicone Encapsulant

   • Consists of Part A and Part B. When mixed, it cures to form a resilient, heat-conductive elastomer.

3. Moderate Viscosity & Flow

   • Flows sufficiently to fill gaps and irregular shapes, yet not so fluid as to run off components excessively.

4. Reliable Dielectric Protection

   • Once cured, it provides electrical insulation, helping protect components from short circuits or high-voltage breakdowns.

5. Environmental Durability

   • Maintains performance under moisture, vibration, and broad temperature extremes, contributing to long-term reliability.

2. Applications

1. Power Electronics & Modules

   • Ideal for potting or encapsulating power inverters, converters, and similar devices that generate heat.

2. Automotive & E-Mobility

   • Used in electronic control units (ECUs), battery management systems, and other modules exposed to temperature cycling and mechanical stress.

3. LED Lighting Assemblies

   • Helps draw heat away from LED boards or drivers, improving efficiency and product lifespan.

4. Industrial Control Systems

   • Protects sensors, drives, and power supplies in harsh operating conditions, ensuring stable thermal management.