Fingerprint Sensors – Material Solutions
With the increasing integration of confidential transactions into mobile devices, fingerprint sensors have become essential for security and reliability. Henkel offers a comprehensive portfolio of adhesives and inks to support the robust development of fingerprint sensors.
Here are some popular and widely used materials from Henkel’s fingerprint sensor solutions:
1. Glass to IC Attach Adhesives
- LOCTITE® 3220 – High adhesion, low-temperature cure
- LOCTITE ABLESTIK QMI536NB – Strong bonding with low moisture absorption
2. Electrically Conductive Adhesives
- LOCTITE ABLESTIK 2030SC – Fast cure, good electrical connection
- LOCTITE ABLESTIK CE 3103WLV – High adhesion and conductivity
3. Sensor Die Attach Materials
- LOCTITE ABLESTIK 2025J – High adhesion and low warpage
- LOCTITE ABLESTIK ATB F125E (Film) – Strong attachment with controlled thickness
4. Underfills
- LOCTITE ECCOBOND FP4547 – High adhesion and flexible to reduce stress
- LOCTITE ECCOBOND UF 3808 – Good flowability for die bonding
5. Wirebond Sealing / Encapsulants
- LOCTITE ABLESTIK QMI536NB – Reliable protection for wirebonds
- LOCTITE ECCOBOND UF 3811 – Passes key reliability tests
6. Flexible PCB Reinforcement
- LOCTITE 3217 – Dual-cure flexibility for stress accommodation
- LOCTITE ECCOBOND XE 1218 – Strong adhesion with UV and heat cure options
7. Ring Attach Materials
- LOCTITE ECCOBOND DS 3318LVT – Low-bleed, fast-curing adhesive
- LOCTITE PC 40-UMF – Good adhesion and gap-filling capability
8. Hard Coating Materials
- LOCTITE ABLESTIK 8006NSB – Scratch-resistant, chemical-resistant, and UV-resistant
- LOCTITE ECCOBOND LM 8895 – Durable coating with water resistance
Henkel’s materials are popular choices in fingerprint sensor manufacturing due to their strong adhesion, durability, and reliability in mobile device security applications.
👉For more information, please reach out to us on our Linkedin page: https://www.linkedin.com/company/mro-direct-materials
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