BERGQUIST® LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market
Henkel has introduced BERGQUIST® LIQUI FORM TLF 10000, a high-performance, thermally conductive gel designed for high-power industrial infrastructure devices, including 5G telecom, EV infrastructure, AI, and industrial automation.
This pre-cured, one-part liquid gel offers 10.0 W/m-K thermal conductivity, ensuring efficient heat dissipation while maintaining vertical gap stability (0.5 – 1.5 mm) over 2,350 hours at -40°C to +125°C. It is optimized for high-volume manufacturing, dispensing at speeds of 22 g/min with excellent flow rate stability.
Key Benefits:
✅ High thermal conductivity (10.0 W/m-K) for superior cooling efficiency
✅ Reliable gap stability over extreme temperature ranges
✅ Fast dispensing speeds (22 g/min) for mass production
✅ Single-material solution for various applications, simplifying the supply chain
✅ Pre-cured, one-part gel eliminates mixing, ensuring easy handling
✅ Low assembly stress, reducing the risk of component damage
✅ Wide operating temperature range (-60°C to +200°C)
✅ UL 94 V-0 flame retardant rating for enhanced safety
This innovation aligns with Henkel’s commitment to advanced thermal management for next-generation electronics and industrial applications.
👉For more information, please reach out to us on our Linkedin page: https://www.linkedin.com/company/mro-direct-materials
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AVANTEK VIET NAM
💕 Trust MRO, direct materials and equipment solutions
🌐 https://avantek.vn
📧 info@avantek.vn
☎ (+84) 944 415 762 & (+84) 889 901 929
