Bostik’s Low Pressure Molding (LPM) Solutions
Overview
Bostik, an Arkema company, is a leader in smart adhesives and low pressure molding (LPM) technology. LPM is used to encapsulate and protect electronic components from moisture, dust, dirt, and debris.
Key Benefits of LPM
- Simplified Process: A fast, single-step method combining plastic injection and resin potting.
- Energy & Cost Efficiency: Low injection pressure reduces equipment needs and energy consumption.
- High Performance: Provides water-tight, shock-resistant, and high-temperature stability for electronics.
- Eco-Friendly: Solvent-free, bio-based materials (up to 80%), recyclable excess material, and long shelf life.
Bostik’s LPM Solutions
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Thermelt Hot Melt Polyamides
- Designed for multipurpose encapsulation with easy processing at low temperatures.
- High resistance to temperature, oil, and environmental factors.
- Common applications: PCBs, connectors, sensors, automotive components, and LED encapsulation.
Popular Grades:
- Thermelt 861 & 867 – General-purpose with good adhesion and thermal resistance.
- Thermelt 868 & 858 – Excellent UV and moisture resistance for outdoor applications.
- Thermelt 195 – High thermal stability and hardness for electronics overmolding.
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Reactive Polyamides (PAR)
- Provide superior temperature resistance (up to 200°C).
- Ideal for automotive and industrial electronics where extreme durability is needed.
Popular Grades:
- PAR1000 & PAR1002 – Excellent high and low-temperature resistance for cables, connectors, and electronic components.
Key Applications
- Automotive – Overmolding of sensors, connectors, and cables.
- Electronics – Encapsulation of PCBs, antennas, and LEDs.
- Industrial – Protective sealing of delicate components.
