Chipbonder adhesives, commonly known as SMT (Surface Mount Technology) SMD (Surface-Mounted Device) BGA (Ball Grid Array) IC Red Glue, are thermosetting adhesives used in PCB assembly. These adhesives are primarily used for component bonding before wave soldering and reinforcement of SMD components.
Key Features of Chipbonder Red Glue:
- High-temperature resistance (suitable for reflow and wave soldering)
- Excellent adhesion to PCBs and SMD components
- Fast curing (typically heat-cured at 120–150°C)
- Prevents component shifting during soldering
- Good electrical insulation
Henkel’s Chipbonder adhesive family for surface‐mount applications:
LOCTITE® 3609
Description:
A one‐part, red epoxy adhesive provided in a syringe format. It is engineered for medium‐ to high‐speed dispense applications where excellent “green” strength is needed to hold large surface‐mounted components in place before wave soldering.
Typical Specifications (Approximate):
- Cure Type: Heat cure
- Cure Profile: Generally cured at around 90 seconds at 150 °C (or alternatively 3–4 minutes at 125 °C)
- Shear Strength: In the range of ~2175 psi (similar to other Chipbonder adhesives)
- Dispense Performance: Optimized for consistent deposit control at medium-to-high dispense speeds
- Storage Temperature: Typically recommended at 2–8 °C
LOCTITE® 3611
Description:
Another member of the Chipbonder series, LOCTITE® 3611 is designed for surface‐mount bonding applications requiring precise dispense control and high bond reliability. It is generally used for bonding SMD components to PCBs prior to soldering.
Typical Specifications (Approximate):
- Cure Type: Heat cure
- Cure Profile: Comparable to other chipbonder adhesives (e.g., around 90 seconds at 150 °C or 3–4 minutes at 125 °C)
- Bond Performance: Offers high shear strength and stable electrical insulation properties
- Rheology: Formulated for controlled, repeatable dispensing; specific viscosity/yield point values are detailed in the product’s TDS
- Storage Temperature: Typically 2–8 °C
LOCTITE® 3616
Description:
A one‑part, red epoxy adhesive designed for bonding SMDs to PCBs before wave soldering. It’s optimized for printing a range of dot heights with one stencil thickness and offers high wet strength along with fast print speeds.
Key Specifications:
- Cure System: Heat cure
- Cure Time: 90–120 seconds at 150 °C
- Shear Strength: ≥2175 psi
- Dielectric Strength: 33.5 kV/mm
- Viscosity: 15,000–55,000 cP at 25 °C
- Storage Temperature: 2–8 °C
- Specific Gravity: 1.33 at 25 °C
- Thermal Conductivity: 0.2 W/mK
- Volume Resistivity: 4.6×10^15 ohm-cm
LOCTITE® 3619
Description:
A one‑part epoxy adhesive formulated for bonding SMDs to PCBs where low curing temperatures are critical—ideal for heat-sensitive components and applications that require short cure times.
Key Specifications:
- Cure Type: Heat cure
- Cure Schedule: Approximately 30 minutes at 100 °C
- Physical Form: Paste
- Shear Strength: ~2030 psi on grit blasted steel
- Viscosity: 1.0–4.0 Pa∙s at 25 °C
- Storage Temperature: 2–8 °C
LOCTITE® 3621
Description:
A one‑part epoxy gel adhesive engineered for ultra-high-speed syringe dispensing. It is used in applications (such as Dispense Jet) that demand very high throughput along with excellent humidity resistance and electrical performance.
Key Specifications:
- Cure Profile:
- 90 seconds at 150 °C
- 3–4 minutes at 125 °C
- Dispense Speed: Up to 47,000 drops per hour
- Storage: Room temperature storage is acceptable
- Application: Optimized for ultra-high-speed dispensing
LOCTITE® 3627
Description:
A high-speed stencil print adhesive suited for surface mount applications. It is compatible with equipment such as DEK® Proflow® and MPM® Rheopump® systems, making it an excellent choice for processes like DEK® Proflow® Pumprint.
Key Specifications:
- Cure Profile:
- 90 seconds at 150 °C
- 3–4 minutes at 125 °C
- Application: Designed for stencil printing at speeds between 60 and 150 mm/s
- Storage Conditions: 5 °C ± 3 °C
- Shelf Life: Approximately 6 months
Additional Information
For more detailed technical data, application notes, and downloadable Technical Data Sheets (TDS), please refer to the downloadable resources provided. For direct inquiries or to obtain additional documentation, please contact Avantek VN.
