EPO-TEK: fiber optic

EPO-TEK® offers a range of low outgassing adhesives specifically designed for the fiber optic industry, ensuring minimal contamination and high reliability in optical applications. These adhesives comply with stringent industry standards, including NASA’s ASTM E595 and MIL-STD 883/5011, which require total mass loss (TML) of less than 1.0% and collected volatile condensable materials (CVCM) below 0.1% under specified conditions

Key Technologies and Applications

Telecom Applications

  • RF/Microwave Assemblies:
    Chip, Substrate & Package Bonding: EPO-TEK® epoxies are used to bond and seal components in microwave circuits.
    Satellite Communication Hardware: Includes antennas, transmitters, receivers, and connectors where both conductive silver epoxy and dielectric materials are applied.

  • Fiber-Optic Solutions:
    Fiber-Optics Cabling & Components: Specialized optical-grade and UV cure epoxies enable active optical alignment for diodes, lenses, and waveguide substrates.
    Optical Interconnects: Ensuring precise alignment and robust bonding for high-performance fiber optic circuitry.

Optical Applications

  • Optical Components & Devices:
    Cameras, Lasers & Telescopes: EPO-TEK® adhesives encapsulate, coat, bond, and seal plastics, crystals, and glass, which are essential in making prisms, filters, mirrors, and other optical elements.
    Display Technologies: They also ruggedize and toughen LCD touch panels with transparent adhesives used in plastic lamination.
    LED Packaging: Through liquid injection molding, their optical epoxies form protective plastic caps over LEDs.

  • Additional Markets:
    Sensors and Spectrometers: The adhesives are critical in assembling devices that require high optical clarity and precision.
    Solar/Photovoltaic Systems: Their UV curing resins not only aid in efficient light harvesting but also provide watertight protection for solar cells.


Advantages of EPO-TEK® Adhesives

  • Proven Track Record:
    Serving the optical market since 1969 (with the introduction of EPO-TEK® 301), the products have a longstanding history of reliable performance.

  • Tailored Formulations:
    Whether you need optical clarity, UV curing capabilities, or conductive properties, EPO-TEK® offers specialized adhesives designed for each application.

  • Environmental Versatility:
    The adhesives are engineered to perform reliably in a wide range of environments—from outer space and underwater installations to terrestrial telecom and optical systems.

  • Comprehensive Support:
    The company emphasizes custom solutions, supported by experienced specialists who work directly with customers to address unique project challenges.

  • Cross-Market Applications:
    Beyond telecom and optical systems, these adhesives serve diverse industries including military, medical, scientific, and alternative energy, highlighting their flexibility and robust performance.

EPO-TEK® provides a comprehensive selection of adhesives tailored for the fiber optic industry, each engineered to meet specific application requirements. Here are some notable products:

EPO-TEK® 353ND
A non-conductive, two-component, high-temperature epoxy renowned for its reliability in semiconductor, hybrid, fiber optic, and medical applications. It offers excellent adhesion to various substrates, including metals, plastics, and glass, and is known for its high glass transition temperature (Tg) and low outgassing properties.

EPO-TEK® 301-2
A two-component, clear and colorless, room temperature curing epoxy suitable for sensor applications in infrared and medical CT detectors. It is USP Class VI approved, ensuring biocompatibility for medical device applications.

EPO-TEK® 302-3M
A two-component, fast-gelling, room temperature curing epoxy designed for electronic, optical, medical, and general applications. It is suitable for adhesive joining, sealing, potting, or as a coating.

EPO-TEK® 377
A two-component, high Tg, fiber optic grade epoxy adhesive well-suited for semiconductor, medical, and optical applications. It offers excellent adhesion to various substrates and is known for its high glass transition temperature and low outgassing properties.

EPO-TEK® H20E
A two-component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity.

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