Henkel Semiconductor Packaging Materials
Henkel is presenting its advanced semiconductor packaging solutions, highlighting high-reliability materials for automotive, industrial, and high-performance computing applications.
💡 Key Innovations:
🚗 Automotive Electrification & Reliability
- Loctite Ablestik 6395T & Loctite Ablestik 8068TI
- Grade 0 automotive reliability with high thermal conductivity.
- Pressure-less sintering for improved processing efficiency.
- Loctite Ablestik CDF 200P & CDF 600P (Conductive Die Attach Films)
- Tight bondline control with no die tilt or resin bleed.
- Optimized for QFPs & TSSOPs in microcontroller unit packaging.
🔥 High-Performance Computing & Mobile Processing
- Loctite Eccobond UF 9000AG (Capillary Underfill)
- High filler loading & fast flow for enhanced chip protection.
- Supports advanced Si node flip chips for AI & HPC applications.
- Lid & Stiffener Attach Materials
- Reduces warpage & maintains coplanarity in 2.5D/3D packages.
- May provide grounding & shielding for added device stability.
Henkel remains committed to supporting next-gen semiconductor advancements with its cutting-edge die attach adhesives, conductive films, and underfill materials.
