Applications

DOWSIL™ SE 9185 Clear or White Adhesive – Adhesive – PCB System Assembly

-Item Name: DOWSIL™ SE 9185 Clear or White Adhesive
-Manufacturer: Dow
-Technologies: One-part polydimethylsiloxane
-Color: Clear or White
-Cure Type: Room temperature moisture cure
-Package Size: Contact to Avantek for details.
-Shelf Life: Contact to Avantek for details.

1. Product Overview

DOWSIL™ SE 9185 is a one-part, non-flowing, fast tack-free adhesive with controlled volatility. It is available in clear or white and is based on polydimethylsiloxane. It cures at room temperature with the option for heat acceleration, eliminating the need for ovens.

2. Applications

  • Sealing PCB system assembly equipment and modules
  • Fixing parts on circuit boards

3. Typical Properties

Property Unit Value
One-part or Two-part One-part
Color Clear or White
Specific Gravity (Cured) 1.05
Tack-Free Time (25°C) minutes 8
Tensile Strength psi / MPa / kg/cm² 435 / 3 / 30
Elongation % 515
Hardness Shore A 31
Lap Shear Adhesion (Glass) N/cm² 120
Dielectric Strength volts/mil / kV/mm 550 / 22
Volume Resistivity ohm*cm 2.0 × 10¹⁶
Dielectric Constant (1MHz) 2.8
Dissipation Factor (1MHz) 0.0007
Low Molecular Siloxane (D4-D10) ppm 25
Low Molecular Siloxane (D4-D20) ppm 200

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