KYZEN MICRONOX MX2123 at IMAPS Wire Bonding 2025
KYZEN showcasing its MICRONOX MX2123 power module cleaner.
MICRONOX MX2123 Highlights:
✅ Multi-phase chemistry for removing flux residues from IGBT modules & PCBs
✅ Compatible with copper, silver, and nickel DBC substrates
✅ Removes slight metal oxidation, improving post wire bond & potting processes
✅ Works at low temperatures & concentrations in SIA or ultrasonic immersion systems
With increasing demand for high-performance advanced packaging, KYZEN continues to offer innovative cleaning solutions and process optimization services.
The IMAPS Wire Bonding Workshop is a key industry event that brings together scientists, engineers, manufacturers, and academics to discuss the latest advancements in wire bonding for battery packs, semiconductors, and microelectronics packaging.
KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards.
